Abstract:Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is the change of the roughness of the solder mask to influence the flux spreading around the solder pad. The second approach is the deposition of the same volume of the solder paste to the solder pads using a modified, thicker stencil with smaller apertures. Th… Show more
“…The surface mount components were then put on top of the PCB pads using a pick and place procedure. The solder joints between the components and PCB are formed via solder reflow process in a reflow oven (Bachok et al , 2023; Gao et al , 2023; Kozak et al , 2023; Tsai, 2011; Yang et al , 2005).…”
Purpose
This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
Design/methodology/approach
The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.
Findings
The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.
Originality/value
Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.
“…The surface mount components were then put on top of the PCB pads using a pick and place procedure. The solder joints between the components and PCB are formed via solder reflow process in a reflow oven (Bachok et al , 2023; Gao et al , 2023; Kozak et al , 2023; Tsai, 2011; Yang et al , 2005).…”
Purpose
This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.
Design/methodology/approach
The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.
Findings
The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.
Originality/value
Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.
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