2002
DOI: 10.1016/s0022-3093(02)00933-x
|View full text |Cite
|
Sign up to set email alerts
|

Study of the stability of polycrystalline silicon by means of the behavior of thin film transistors under gate bias stress

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2006
2006
2010
2010

Publication Types

Select...
2

Relationship

1
1

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 6 publications
0
2
0
Order By: Relevance
“…The small V T shift observed in this case (∆V T ~ 0.5 V), imputable to the disordered structure of nc-Si:H [8], is another argument to use these TFTs in the OLED addressing.…”
Section: Stability Under Gate Bias Stressmentioning
confidence: 79%
“…The small V T shift observed in this case (∆V T ~ 0.5 V), imputable to the disordered structure of nc-Si:H [8], is another argument to use these TFTs in the OLED addressing.…”
Section: Stability Under Gate Bias Stressmentioning
confidence: 79%
“…The stress condition is the same as the BTS. The straight lines lead to the stretched exponential form for the normalized threshold shift, which can be written as [13] a-Si:H TFT stability in terms of V TH shift can be explained by high and low field bias stresses, meaning that metastable states in the a-Si:H at low positive bias are created, while charge trapping in SiN X at high positive and negative bias has occurred. Thus, it can not be expected good stability in high field bias case due to the effect of low power SiN X .…”
Section: Resultsmentioning
confidence: 99%