Abstract:This paper investigates the mechanical behavior of a copper–solder interface when subjected to varying strain rate loading between 0.05 s−1 and 10.0 s−1. The copper is alloy 101, and the solder is lead-free type with a composition of 96% tin and 4% silver. Both uniform and nonuniform two-level strain rate loadings were applied. For the two-level strain rate loading, the strain rate was changed from one level to another during the loading process as a step change. The strain rate tests were performed at… Show more
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