Al 2 O 3 films deposited on 4H-SiC(0001) by atomic layer deposition (ALD) were characterized by XPS, and high-resolution transmission electron microscopy (HRTEM). The effect of medium and high temperature (873, 1273 K) annealing on samples with oxide thicknesses of 5-8 and 100-120 nm was studied. XPS indicated the presence of a thin (∼1 nm) SiO x layer on the as-grown samples which increased to ∼3 nm after annealing above crystallization temperature (1273 K) in Ar atmosphere. Upon annealing the stoichiometry of the interfacial oxide approaches that of SiO 2 . HRTEM showed that the thickness of the interfacial oxide formed after annealing at 1273 K was not uniform. No significant increase in the thickness of the interfacial oxide, was observed after annealing at 873 K in a N 2 (90%)/H 2 (10%) atmosphere.