State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

Zhou, Libo; Eda, Hiroshi; Shimizu, Jun

doi:10.1016/s0924-0136(02)00571-x

Cited by 21 publications

(15 citation statements)

References 2 publications

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“…Most wafer grinding systems utilize the rotational in-feed grinding method to keep the contact area unchanged and thereby deliver a stable grinding performance throughout the grinding process (Zhou, et al, 2002). During grinding, the Si wafer was mounted on a porous ceramic vacuum chuck, and sufficient purified water was applied to the grinding zone as coolant.…”

Section: Experimental Description and Resultsmentioning

confidence: 99%

“…A kinematical analysis is useful to address the behavior of each grain in wafer surface generation (Zhou, et al, 2002, 2003, Chen and Hsu, 2006, 2008. The 3D model of rotational in-feed grinding method is shown in Fig.…”

Section: Kinematical Analyses 31 3d Cutting Path and Resultant Wafermentioning

confidence: 99%

“…7 also suggested a fact that the cutting path in each case becomes denser inward the wafer center. It is known that denser cutting path delivers a better surface roughness (Zhou et al, 2002). Therefore, it is important to quantitatively understand the variation of the cutting path density at different wafer radius.…”

Section: Cutting Path Densitymentioning

confidence: 99%

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Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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Silicon (Si) is a fundamental material in the semiconductor industry. The advancement of semiconductor devices have offered convenience and comfort to our life. In order to raise productivity and economic efficiency, the semiconductor industry keeps looking for use of larger size Si wafers. The next generation wafer is expected to be sized as large as 450 mm in diameter. Many wafering processes including lapping, grinding and polishing have been studied and grinding technology stands out as the most promising process for large-size Si wafer manufacturing. In the current in-feed grinding scheme adopted for Si wafers, the wheel diameter used is generally equal to or larger than the wafer diameter. In turn, larger diameter wheels require larger size machine tools and production lines, which lead to increase in manufacturing costs. In this paper, both experiment and kinematical analysis have been carried out to investigate the feasibility of using small diameter grinding wheels to grind large size Si wafers, mainly focusing on the effects of wheel diameter on wafer geometry and surface roughness. The results show that both wheels generated a central convex profile on the wafer and the small wheel achieved a slightly better flatness than the large wheel. The surface roughness were similar one to another for most area of the wafer except the fringe around its edge. All these experimental results were predicable by the kinematic model established in this paper. Particularly, the kinematic analysis found that the cutting path made by small wheel with diameter equaling to the wafer radius was parallel each other at the fringe around wafer edge, which directly worsened the surface roughness.

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Section: Experimental Description and Resultsmentioning

confidence: 99%

Section: Kinematical Analyses 31 3d Cutting Path and Resultant Wafermentioning

confidence: 99%

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Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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“…The effect of this has been modelled and simulated to predict surface roughnessand chip-scale parameters [7,8,9] while, experimentally, local normal forces have been measured by integrating a miniature piezoelectric force in the force flux of a single grinding segment [9,10]. Varying levels of surface roughness and subsurface depth of damage have also been confirmed experimentally [9,11] while variations in TTV and planarity are also possible on machines of non-infinite stiffness whereelastic deflections are present at the end of the machine cycle [9,12].…”

Section: Introductionmentioning

confidence: 99%

Dual mode control of the rotational grinding process

2012

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Publisher's statementThis is the author's version of a work that was accepted for publication in CIRP Annals -Manufacturing Technology. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in CIRP AnnalsManufacturing Technology (61, 1, (2012) The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for microfabrication of semiconductor integrated circuits. Improvements in process capability, with respect to both form and finish, have been generally realised by the development of machine tools and systems based on a principle of precise and predictable "position" control. An alternative principle for optimisation is demonstrated here comprising a dual mode control system where a "finishing mode" is based on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation.

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“…Zhou et al [8] studied an advanced manufacturing method for silicon wafers, using fixed abrasive instead of free slurry, to provide excellent surface roughness and global flatness. The denser cutting path contributes to surface roughness improvement, but an excessive cutting path density often leads to sever burn marks on the wafer surface.…”

Section: Introductionmentioning

confidence: 99%

Grinding characteristics of micro-abrasive pellet tools fabricated by a LIGA-like process

Luo

Liu

et al. 2009

International Journal of Machine Tools and Manufacture

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State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

Cited by 21 publications

References 2 publications

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Dual mode control of the rotational grinding process

Grinding characteristics of micro-abrasive pellet tools fabricated by a LIGA-like process

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