Dual mode control of the rotational grinding process

Abstract

Publisher's statementThis is the author's version of a work that was accepted for publication in CIRP Annals -Manufacturing Technology. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in CIRP AnnalsManufacturing Technology (61, 1, (2012) The rotational grinding process enables the production of substrates to meet the submicron planarity specifications required for microfabrication of semiconductor integrated circuits. Improvements in process capability, with respect to both form and finish, have been generally realised by the development of machine tools and systems based on a principle of precise and predictable "position" control. An alternative principle for optimisation is demonstrated here comprising a dual mode control system where a "finishing mode" is based on local normal force control. Test results show significant relative improvements in levels of surface roughness and a reduction in the normal spatial variation.