2016
DOI: 10.1016/j.ijmachtools.2016.04.010
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A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers

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Cited by 33 publications
(8 citation statements)
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“…SSD is detrimental to the performance and lifetime of the final part made of a silicon wafer. Zhou et al (2016) found that residual stresses resulted in warpage which increased the possibility of the wafer breakage and failure. Zhang et al (2018) suggested that the phase transformation in silicon were intolerable to the application of the integrated circuits and photovoltaics; Yin et al…”
Section: Introductionmentioning
confidence: 99%
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“…SSD is detrimental to the performance and lifetime of the final part made of a silicon wafer. Zhou et al (2016) found that residual stresses resulted in warpage which increased the possibility of the wafer breakage and failure. Zhang et al (2018) suggested that the phase transformation in silicon were intolerable to the application of the integrated circuits and photovoltaics; Yin et al…”
Section: Introductionmentioning
confidence: 99%
“…Currently, there are two types of the methods for detecting SSD, namely, destructive and nondestructive methods. In terms of the destructive methods, Gao et al (2010) used the angle J o u r n a l P r e -p r o o f polishing method to obtain depth of SSD; Yin et al (2018b) used the cross-sectioning technique to study the configuration of subsurface cracks; Zhou et al (2016) revealed the microstructure in the wafers with the transmission electron microscopy; and Sekhar et al (2018) carried out the chemical etching to elucidate the asymmetry to the depth of SSD induced in the wire sawing.…”
Section: Introductionmentioning
confidence: 99%
“…Load identification is an important research area in structural health monitoring [ 1 , 2 , 3 , 4 ]. For reliability and cost effectiveness in the design and analysis of structures, accurate identification of the location and magnitude of a load is desirable.…”
Section: Introductionmentioning
confidence: 99%
“…Load identification algorithms [ 3 , 4 , 5 , 6 , 7 ] can be divided into time domain algorithms and frequency domain algorithms. Compared to frequency domain algorithms, time domain algorithms are much more valuable.…”
Section: Introductionmentioning
confidence: 99%
“…In summary, input forces estimation algorithms [ 2 , 3 , 4 , 5 , 6 , 7 ] can be divided into time domain algorithms and frequency domain algorithms. Time domain algorithms are much more valuable than frequency domain algorithms, as time domain algorithms can accomplish estimation in real-time.…”
Section: Introductionmentioning
confidence: 99%