Stability of miniaturized non-trimmed thick- and thin-film resistors

Rovensky, Tibor; Pietriková, Alena; Vehec, Igor; Livovský, Ľubomír

doi:10.1016/j.microrel.2018.03.011

Cited by 11 publications

(3 citation statements)

References 10 publications

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“…The use of these components in electronic products is steadily increasing, and, although their dimensions are constantly decreasing, the surrounding area cannot be further reduced due to the limitations imposed by the assembly equipment and the requirements of the soldering process. [28][29][30][31][32][33][34][35] The idea of packing more components on/in a PCB by introducing new technologies for integrating components with it is now becoming a necessity for manufacturers of modern equipment.…”

Section: Introductionmentioning

confidence: 99%

Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses

Stęplewski

Rybak

Dziedzic

et al. 2023

J. Electron. Mater.

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The technique of embedding components inside printed circuit boards (PCBs) is described, using different filling masses. To investigate the possibility of placing the components inside the printed circuit board, a residual circuit breaker with an overload protection (RCBO) system was adapted. Four types of fillings (two epoxy and two silicone) were used in the tests, which were carried out showing the full functionality of the systems embedded in the PCB, regardless of the applied sealing compound. A certain disadvantage was the shrinkage of the applied masses, which was visible in some cases in the occurrence of gaps in the flooding spaces. However, it should be emphasized that the tests were preliminary and that the adjustment of the filling shrinkage will be optimized in subsequent tests.

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Section: Introductionmentioning

confidence: 99%

Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses

Stęplewski

Rybak

Dziedzic

et al. 2023

J. Electron. Mater.

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“…However, all of them contains precious metal elements which is not bene cial to lower the production cost of manufacturing TFRs. Considering this problem, some base metals (like Cu, Al), SnO 2 and MoO 2 , or carbon paste, have been researched as functional phase of TFRs [11][12][13][14]. Nevertheless, either their sintering processes depend on inert atmospheres or their electrical performances (resistance and TCR) are poor [3,13].…”

Section: Introductionmentioning

confidence: 99%

High-performance electrical properties of La-based perovskite ceramics for the functional phase of thick film resistors

Chen

et al. 2021

Journal of Alloys and Compounds

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In order to explore an economical functional phase alternative material for thick lm resistors, the crystal structure, microstructure, and electrical properties of (1-x)LSCN + xLCNZ (x = 0.0-1.0) composite ceramics were studied through solid-state reaction experiments. The composite ceramics were characterized by xray diffraction, scanning electron microscopy, energy dispersive x-ray spectroscopy, and DC four-probe method. Results suggested that the main phases of LSCN and LCNZ were formed, along with a small part of impurity phases. The addition of LCNZ to LSCN decreased the electrical conductivity and changed the TCR from positive to negative. Zero TCR could be achieved around 0.6 < x < 0.8 and relatively low absolute TCR values could be obtained for the samples of 0.4 ≤ x ≤ 0.8. The ceramic of 0.6LSCN + 0.4LCNZ showed the optimal performances of conductivity = 1923 S/cm, TCR = 379.54 ppm/℃, and relative density = 95.05%.

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“…Bearing in mind the existing trend in the electronic industry to produce smaller and smaller devices, one of the examined approaches is embedding passive and active components into printed circuit boards (PCBs). So far many research works concerning thin- and thick-film passive components embedded in PCBs have been reported by Rahayu et al (2013), Akahoshi et al (2019), Balmont et al (2018) and Rovensky et al (2018). However, to produce more functional devices, such solutions are not sufficient.…”

Section: Introductionmentioning

confidence: 99%

Investigations of temperature sensor embedded into PCB

Janeczek

Araźna

Stęplewski

et al. 2020

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Purpose The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties. Design/methodology/approach A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries. Findings The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity. Research limitations/implications It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties. Practical implications The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way. Originality/value This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

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Stability of miniaturized non-trimmed thick- and thin-film resistors

Cited by 11 publications

References 10 publications

Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses

Technology of Standard SMT Components Embedded Into PCB by Using Different Materials as Filling Masses

High-performance electrical properties of La-based perovskite ceramics for the functional phase of thick film resistors

Investigations of temperature sensor embedded into PCB

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