Split sputter mode: a novel sputtering method for flat-panel display manufacturing

Abstract

Advanced static DC magnetron sputtering methods based on the magnet wobbling technique were investigated to achieve highly uniform and homogeneous metallization layers. The novel split sputter mode (SSM) method, wherein the deposition process is divided into two distinct steps, enables the AKT rotary cathode technology to provide excellent layer properties, while keeping a high production throughput. The effectiveness of the SSM technique was demonstrated through copper-coated large-area substrates.

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“…Results prove that for rotary targets optimization of magnet movement is effective for fully-reactive AC process in the same way as had been formerly shown for non-reactive DC processes [8]. Thickness uniformity of Al 2 O 3 process on Gen 8.5 scale was about ±10%, uniformity of refractive index at 550 nm was about ±1% (figure 10).…”