Soybean meal-based wood adhesive enhanced by ethylene glycol diglycidyl ether and diethylenetriamine

Li, Jingjing; Luo, Jing; Li, Xiaona; Zhao, Yijiang; Gao, Qiang; Li, Jianzhang

doi:10.1016/j.indcrop.2015.05.066

Cited by 101 publications

(49 citation statements)

References 24 publications

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“…The FT‐IR spectra of the cured soybean meal (SM) adhesive, epoxy resin modified SM (SM/EP) adhesive, and pMDI blended SM/EP (SM/EP/pMDI) adhesives are given in Figure . The broad band between 3200 and 3500 cm −1 corresponded to free and bound N‐H and O‐H groups, which are the functional groups forming hydrogen bond with wood . The peak observed at 2930 cm −1 was attributed to C‐H stretching vibrations of methyl groups.…”

Section: Resultsmentioning

confidence: 99%

Effects of polyisocyanate on properties and pot life of epoxy resin cross‐linked soybean meal‐based bioadhesive

Luo

et al. 2016

J of Applied Polymer Sci

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In this study, polyisocyanate (pMDI) was introduced into epoxy resin modified soybean meal-based bioadhesive to address the issue of low dry bond strength. Specifically, we investigated the effects of adding pMDI in terms of amount and storage time on dry bond strength, water resistance, and pot life of adhesive. Factors examined included shear strength, apparent viscosity, chemical reaction, crystallinity, and morphology of modified adhesives. Results indicated that the dry bond strength and water resistance of the resultant plywood was respectively improved 29.5% and 39.7% by adding 2% pMDI. In addition, the pot life of modified adhesive reached in 4 h. Results also shown that the cross-linking reactions between epoxy group and carbonyl as well as isocyano and amino increased the cross-linking density and formed a denser cross-linking network structure of cured adhesive. The composite cross-linked soybean mealbased adhesive is environmental-friendly and high-performance, which will promote the industrial application of the soy protein-based adhesives.

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Section: Resultsmentioning

confidence: 99%

Effects of polyisocyanate on properties and pot life of epoxy resin cross‐linked soybean meal‐based bioadhesive

Luo

et al. 2016

J of Applied Polymer Sci

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“…The dry‐ and wet‐shear strengths of the plywood specimens were tested on a universal material testing machine (Ke Hui WDW‐50D, China) operating at a speed of 10.0 mm/min. The dry‐ and wet‐shear strengths (including the wet bonding strength and boiling water strength) were calculated with the method reported by Li et al …”

Section: Methodsmentioning

confidence: 99%

High bonding strength and boiling water resistance of soy protein‐based adhesives via organosilicon–acrylate microemulsion and epoxy synergistic interfacial enhancement

Zhao

Xing

Wang

et al. 2017

J of Applied Polymer Sci

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Boiling water resistance, an important indicator of wood adhesives, represents the capability of adhesives for exterior woodwork applications. However, soy-based adhesives show poor behaviors in this respect, which limit their applications in outdoor environments. In this article, we report a synergistic modification method of integrating a cocrosslinking system of epoxied polyamideamine-epichlorohydrin (PAE) and organosilicon-acrylate copolymer latexes (OACLs) to improve soybean meal (SM)-based adhesive properties. Tailored PAE and OACL SM-based adhesives demonstrated robust crosslinking structures via multi-interfacial interactions, where PAE and OACL served as building blocks of an interpenetrating network, which was characterized by Fourier transform infrared spectroscopy, X-ray diffraction, thermogravimetric analysis, and scanning electron microscopy. The dry-shear strength, wet-shear strength, and boiling water strength of the resulting SM-based adhesives were 1.41 6 0.13, 1.32 6 0.17, and 1.20 6 0.11 MPa, respectively, with 15 wt % OACL loading; these were 41, 45, and 90% increases, respectively, over the SM-PAE adhesive with which we compared them. Most importantly, the excellent boiling water resistance of the adhesives make them practical for exterior plywood.Crosslinking is a particularly effective approach for enhancing adhesion properties. Currently, aldehydes, epoxy compounds, natural gellan, and genipin are the most commonly used crosslinkers to form intrapenetrating or interpenetrating networks with a soy-protein matrix. 3,4,17 When the crosslinked adhesive is used under humid conditions, the uniform and tough network limits the permeation of water molecules and, thus, improves the adhesion performance. For example, Li and coworkers 18,19 designed a series of soy protein-based adhesives consisting of a covalently crosslinked polyamideamine-epichlorohydrin (PAE) network and a physically crosslinked attapulgite or carboxylated styrene-butadiene rubber latex network between soy-protein matrixes. The boiling water strength of these adhesives ranged V C 2017 Wiley Periodicals, Inc.

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“…In response to the concern on a new type of formaldehyde-free adhesives, great attentions have been paid to wood adhesives prepared from renewable and natural materials without formaldehyde addition, including starch and soy flour [1][2][3]. Most studies have been based on these two materials, which are both abundant and effective in the preparation of formaldehyde-free adhesives [4,5]. However, starch is mainly derived from foodstuff such as rice, wheat, and potato, threatening the normal food supply of humans.…”

Section: Introductionmentioning

confidence: 99%

“…At first, researchers used alkali [8], urea [9], sodium dodecyl sulfate (SDS) [4], and sodium dodecyl benzene sulfonate (SDBS) [10] to break down the structure of soy protein to enhance bonding strength and water resistance of SFAs. However, the wet shear strength of wood panels adhered by these adhesives did not meet the requirements of type II application (≥0.7 MPa).…”

Section: Introductionmentioning

confidence: 99%

Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane

Wang

Lou³

et al. 2019

International Journal of Polymer Science

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In this paper, thermogravimetric (TG) analysis was carried out to make clear the curing properties of soy flour-based adhesives (SFAs) enhanced by waterborne polyurethane (WPU) with different addition levels. The kinetic parameters were evaluated by a thermal dynamics method, including activation energy and preexponential factor. In addition, the structure characteristics of both soy flour and modified soy flour-based adhesives were tested by Fourier transform infrared spectroscopy (FTIR). The results revealed that the FTIR spectra of pristine soy flour-based adhesives were different from those of soy flour after alkali treatment and waterborne polyurethane modification. Furthermore, there were four main degradation phases in the derivative thermogravimetric (DTG) curves of modified soy-based adhesives while there were two phases of a defatted soy flour sample. The kinetics analysis demonstrated that the curing process could be described as a consecutive first-order curing process. Moreover, with the addition level of WPU growing, the apparent activation energy of each phase of the curing process was increasing compared with that in pristine soy-based adhesives.

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Soybean meal-based wood adhesive enhanced by ethylene glycol diglycidyl ether and diethylenetriamine

Cited by 101 publications

References 24 publications

Effects of polyisocyanate on properties and pot life of epoxy resin cross‐linked soybean meal‐based bioadhesive

Effects of polyisocyanate on properties and pot life of epoxy resin cross‐linked soybean meal‐based bioadhesive

High bonding strength and boiling water resistance of soy protein‐based adhesives via organosilicon–acrylate microemulsion and epoxy synergistic interfacial enhancement

Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane

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