Solder Bumping for Flip Chip Bonding

Jae-Pil, Jung; Lee, Hee-Yul; Cheon, Ji-Hun

doi:10.5781/kwjs.2008.26.1.024

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…The disadvantage of MacEtch is that metals used as catalysts, such as Ag, Au, Pt, Pd, and Cu, are expensive, and the diffusion of silicon can adversely affect the performance of CMOS, etc. [73,74]. Recently, the addition of TiN and various carbon nanomaterials such as CNTs, graphite, graphene, and graphene oxide (GO) have been reported [75].…”

Section: Tsv Sidewall With Scallop-free Etchingmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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Section: Tsv Sidewall With Scallop-free Etchingmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps

Heo

Lee

Jeong

et al. 2022

J Mater Sci: Mater Electron

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Ultrasonic Horn Design and Weldability in Thin Ni Plates Welding

Park

Lee

Park

2014

AMR

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In this research, a new ultrasonic horn is designed and fabricated for welding thin Ni plates by vibration analysis. Two types of the horn tip are fabricated to evaluate the effect of horn’s tip on the weldability. Modal analysis, harmonic response analysis and FFT analysis are carried out for verifying the adequacy of the developed horn. To evaluate weldability of two types of horn tip, welding strength and the microstructure of the weld surface are experimentally investigated with various welding parameters such as pressure, time and vibration amplitude. Finally, the new horn with resonant frequency of 40 kHz is developed, and it is shown that welding strength and the microstructure of the weld surface are largely affected by horn’s tip shape.

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Solder Bumping for Flip Chip Bonding

Cited by 4 publications

References 3 publications

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps

Ultrasonic Horn Design and Weldability in Thin Ni Plates Welding

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