Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps

Heo, Min-Haeng; Lee, Donghwan; Jeong, Min-Seong; Yoon, Jeong‐Won

doi:10.1007/s10854-022-07991-7

Cited by 2 publications

(2 citation statements)

References 15 publications

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“…Since the ambient temperature of the two tests is the same, it can be inferred that the electric current has accelerated the damage rate, likely because the current increased the temperature of the solder and decreased its plastic deformation resistance. 22,23 However, no softening was apparent after testing for 120 h. After T-E testing for 240 h, significant softening occurred in the solder of all the solder joints, as shown in Fig. 3c1-10, and the surface of the solder joints was quite uneven.…”

Section: T-e Coupling Damage At a Relatively Low Temperature Rangementioning

confidence: 95%

“…As the strength of the solder decreases with increasing temperature, [23][24][25] once the damage in the solder joint increases to a certain degree, the resistance heat induced by the current will cause the temperature of the solder joint to reach the "softening temperature." It should be noted that the temperature of the solder joints at the later stage of the T-E coupling tests in this study were much higher than in previous reports.…”

Section: T-e Coupling Damage Mechanisms and The Influence Of Temperaturementioning

confidence: 99%

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Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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In this study, in situ investigation of the coupling damage mechanisms of SnAgCu/Cu solder joints under thermal cycling and current was carried out to compare the thermal fatigue under the same temperature range, and to analyze the influence of temperature. It was found that the current increased the temperature of the solder joint, making it obviously higher than the ambient temperature. On the other hand, there was little difference between the thermal-electrical coupling damage and thermal fatigue before a significant increase in solder temperature; the interfacial plastic deformation was only slightly more serious, and the electromigration was not significant. With an increasing number of thermal cycles, the damage, resistance, and temperature of the solder joint increased, and the plastic deformation resistance of the solder decreased, leading to further damage and temperature increase, exhibiting an accelerating damage process. After the temperature reached a certain degree, the solder softened significantly, and its deformation behavior was similar to that of high-viscosity fluids, resulting in surface unevenness with significant height differences. As the temperature of the solder joint increased, the electromigration of Cu in the solder gradually increased, and the migration rate was dominated by the solder grain orientation. With higher peak temperature of the ambient thermal cycle, the thermal cycling-electric current coupling damage rate increased substantially.

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Section: T-e Coupling Damage At a Relatively Low Temperature Rangementioning

confidence: 95%

Section: T-e Coupling Damage Mechanisms and The Influence Of Temperaturementioning

confidence: 99%

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Zhang,

An,

Song

2024

J. Electron. Mater.

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Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling

Garnier,

Castagné,

Moreau

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Effects of shear test temperatures and conditions on mechanical properties of Sn–Ag flip-chip solder bumps

Cited by 2 publications

References 15 publications

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges

Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling

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