Abstract:In this paper, we will study fixed-outline floorplan ning in 3D-IC. Although there is abundant literature on 3D-IC floorplanning, none of them consider the areas and positions of signal through-silicon vias (TSVs). In previous research, TSVs are viewed as points during the floorplanning stage. Ignoring the areas, positions and connections of TSVs, previous research plans TSVs dispersively and estimates the wirelength by measuring the bounding box of pins in a net only. Moreover, although thermal issue is criti… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.