1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4)
DOI: 10.1109/mwsym.1994.335102
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Si/SiGe MMIC technology

Abstract: This contribution gives an overview on the state of the art of Si/SiGe MMIC technology. IMPATT Diodes for transmitters, Schottky diodes for mixers and PIN diodes for switches at W-band frequencies and SiGe-HBTs for oscillators at Ka-band frequencies are integrated on high resistivity silicon substrate.

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Cited by 8 publications
(1 citation statement)
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“…Passive components on low-resistivity silicon substrates are big technological challenges under microwave operations due to the insufficient resistivity of common silicon. In J F Luy's research, high-resistivity silicon substrate ( >2500 cm) had been demonstrated to be adequate for microwave application [1] . However, the passive elements occupy areas is large on high-resistivity silicon, the loss is high still.…”
Section: Introductionmentioning
confidence: 99%
“…Passive components on low-resistivity silicon substrates are big technological challenges under microwave operations due to the insufficient resistivity of common silicon. In J F Luy's research, high-resistivity silicon substrate ( >2500 cm) had been demonstrated to be adequate for microwave application [1] . However, the passive elements occupy areas is large on high-resistivity silicon, the loss is high still.…”
Section: Introductionmentioning
confidence: 99%