In this study, the surface morphology of electrodeposited Ni on single crystal GaAs (001) was investigated by atomic force microscopy (AFM). The images show granular deposits with stepped contours typical of single-crystalline grains. The correlation length correlates very well with the size of the grains, indicating that the layers grow as columns with diameter increasing with thickness. This growth mechanism is observed for layers with thicknesses in the range of 10 to 500 nm at a deposition rate of ~0.5 nm/s. The efficient injection of spin-polarized currents through ferromagnetic/semiconductor interfaces is a critical challenge towards the development of feasible devices for spintronic applications. Operation of these devices would require the growth of ferromagnetic layers onto semiconductor surfaces forming sharp and epitaxial interfaces, thus allowing the transfer of electrons without spin scattering. As it was shown previously [1], electrodeposition of Ni on GaAs substrates is a very promising system for spin injection, since it allows the preparation of epitaxial layers at room temperature with sharp chemical gradients at the interface. This work intends to investigate the roughness evolution of the Ni electrodeposited layers on GaAs as an additional step for the characterization of this system.The substrates were single crystalline, epi-ready, n-doped (ρ = 0.005 Ωcm) GaAs (001). The electrodeposition was carried out under galvanostatic control (current density of 3.5 mA/cm 2 ) at room temperature (RT) in a prismatic cell with vertical parallel electrodes (graphite as a counter electrode) using a potentiostat EG&G Model 273A. The deposition rate was ~0.5 nm/s. The electrical back contact to the substrate was made using a Ga 75 In 25 eutectic, which is liquid at RT. Immediately prior to deposition, the substrates were etched by immersion in a 10% dilute ammonia solution for 2 min subsequently followed by a 30 s rinse in deionized water. Ni was deposited from a 0.1 mol/l sulfate solution (NiSO 4 ) at pH 2.5 without agitating the solution during deposition. The area of deposition on the substrate for each sample was 1 cm 2 .The kinetic roughening process was studied by determining the surface roughness w(l) of the layers as a function of deposition time and scale length, w(l) being the root-mean-square deviation of the surface height h from its mean value: