1998
DOI: 10.1016/s0927-796x(98)00013-8
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Shallow junction doping technologies for ULSI

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Cited by 115 publications
(63 citation statements)
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“…Additionally, the source gases used in ion implantation are also invariably harmful from a health and environmental perspective. 4 An alternative approach to ion implantation is spin-on doping, which consists of depositing a dopant-containing solution onto a semiconductor surface, followed by a diffusion anneal step.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, the source gases used in ion implantation are also invariably harmful from a health and environmental perspective. 4 An alternative approach to ion implantation is spin-on doping, which consists of depositing a dopant-containing solution onto a semiconductor surface, followed by a diffusion anneal step.…”
Section: Introductionmentioning
confidence: 99%
“…The process has low energy requirements, and the product replaces building materials that result in emission of CO 2 and other waste byproducts (168).…”
Section: Renewable Resourcesmentioning
confidence: 99%
“…Nevertheless, in this innovative design it is not possible to resort to a high-temperature thermal process to repair the implantation-induced damage associated with the back-wafer contact doping. This damage consists of Si interstitials, which are injected into the silicon during the implantation [6]. Since they can travel easily in silicon, they are not confined to the actual implanted contact region.…”
Section: Introductionmentioning
confidence: 99%