Sequential self-assembly of micron-scale components with light

Saeedi, E.; Etzkorn, James R.; Parviz, Babak A.

doi:10.1557/jmr.2010.20

Cited by 6 publications

(9 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Finally, in the context of microscale self-assembly, "programmability" implies the ability to direct different reliably reproducible outcomes with the same set of components in a self-assembly process, as are demonstrated in works by Xiong [12] and Parviz [13].…”

Section: Nomenclaturementioning

confidence: 99%

“…demonstrated the possibility to assemble multiple device types simultaneously onto a variety of substrates [1], including flexible plastics [11]. Based on similar delivery and alignment concepts, programmability was also demonstrated through the use of photosensitive materials to control the access of components to binding locations [13].…”

Section: Representative Work In Self-assemblymentioning

confidence: 99%

“…The order for a chemical system with respect to each reactant is experimentally determined, which can be integer or non-integer, typically a value between -2 to 3. The negative values denote species that actively inhibit product formation [13]. The proportionality constant κ is called the rate coefficient and is independent of the concentration.…”

Section: Model Developmentmentioning

confidence: 99%

“…. Our interest to improve this process comes from the fact that template-based self-assembly 13 processes previously presented [27,28] were analogous to the depiction in Figure 2, with the exception that the traps were through-etched trenches on templates (to be elaborated upon in CHAPTER 3). We soon found that using non-participating 'catalyst' components, we can lower the acceleration required to start the stochastic transportation phase of the assembly process, allowing for the reliable delivery of all components.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Programmable self-assembly for microsystem integration

Hoo

Park

Baskaran

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

Department of Electrical Engineering, Department of BioengineeringThis dissertation studies and improves upon template-based self-assembly processes as a suite of techniques for microsystem integration.We first provide an updated definition for microscale self-assembly, and provide a framework that separates all self-assembly processes into three distinct phases which can be independently analyzed.A catalyst-enhanced self-assembly process is then presented, wherein non-participating 'catalyst' components are introduced to a dry-environment batch-assembly process, demonstrating 25 -50% reduction in acceleration needed to trigger part motion and up to four times increase in concentration of parts in motion due to addition of catalysts. The presence of catalytic parts allows stochastic part-to-trap assemblies to be performed at lower accelerations than without, and thus allow said assemblies to be performed further from the acceleration-levels required to free trapped parts; this reduces the probability of part-disassembly, thus improving assembly yield. A model from chemical kinetics theory is adapted for the analysis of this catalyst-enhanced self-assembly process.A variation on the prevalent methodology of driving a stochastic assembly process, using vibrations perpendicular to the assembly surface, is then presented. Using a modified actuator that introduces agitations that are in the plane of the assembly surface, unprecedented control of micropart-motion has been achieved; of note, components can be reliability induced into a "walking mode", where components are moved across surfaces in predetermined directions with a surface-hugging motion. Walking modes enables parts to be moved across surfaces and into binding sites, but do not cause trapped components to disassemble due to the suppression of out-of-plane agitation. Repeatable Finally, the magnetically aided assembly of 01005 surface mount components in a vertical pose is studied by adapting the visual-feedback systems used throughout the thesis work. Electrical performance has been verified, and our process is demonstrated to be competitive against integrated passive elements in terms of area-footprint and capacitive and resistive property-tolerances.

show abstract

Section: Nomenclaturementioning

confidence: 99%

Section: Representative Work In Self-assemblymentioning

confidence: 99%

Section: Model Developmentmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Programmable self-assembly for microsystem integration

Hoo

Park

Baskaran

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

show abstract

“…It employs a stochastic process, where a large number of device blocks are scattered in a fluid, so that all the recesses on the host substrate can capture a device block. The capturing force is, for example, gravity with van der Waals force, [1][2][3][4][5][6][7] electric force, [8][9][10][11][12] surface tension, [13][14][15][16][17][18][19] or magnetic force. 20) So far, various devices have been reported to be assembled using FSA, for example, LEDs, 1,4,8) laser diodes (LDs), 21) high-electron-mobility transistors (HEMTs), 22,23) and nanowires.…”

Section: Introductionmentioning

confidence: 99%

Fluidic Self-Assembly Using Molten Ga Bumps and Its Application to Resonant Tunneling Diodes

Nakano¹,

Shibata²,

Morita³

et al. 2013

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

Fluidic self-assembly (FSA) using molten metal bumps is one of the most promising heterogeneous integration (HI) technologies, which enable us to integrate devices made of various materials on various substrates. We can fabricate the metal bumps using Ga having diameters of 24, 18, 12, and 8 µm with good yield. Using Ga has significant advantages; especially, it includes no toxic metals. These bumps were used for the FSA process of the metal dummy blocks having a diameter of 18 µm, and a good yield of 84% was obtained all over the substrate of about 1×1 cm2. Finally, we applied this method to the resonant tunneling diode (RTD) to verify good electrical, mechanical, and thermal contacts. The RTD device blocks having a diameter of 24 µm have been successfully assembled using the molten Ga bumps. This method is promising for high-performance RTD integration.

show abstract

Surface Tension-Driven Self-Assembly

Mastrangeli

2013

Surface Tension in Microsystems

View full text Add to dashboard Cite

Sequential self-assembly of micron-scale components with light

Abstract: Abstract

Cited by 6 publications

References 21 publications

Programmable self-assembly for microsystem integration

Programmable self-assembly for microsystem integration

Fluidic Self-Assembly Using Molten Ga Bumps and Its Application to Resonant Tunneling Diodes

Surface Tension-Driven Self-Assembly

Contact Info

Product

Resources

About