Self-assembled inorganic micro-display on plastic

Saeedi, E.; Kim, S.S.; Parviz, Babak A.

doi:10.1109/memsys.2007.4433172

Cited by 13 publications

(14 citation statements)

References 4 publications

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“…4.8) [47]. In the research reported on here, an AlAs sacrificial layer was initially stacked on the top of a GaAs substrate [28].…”

Section: Led (Red Light) Fabricationmentioning

confidence: 99%

“…In order to ameliorate the fluctuation of input energy (caused via varying strength of incident RF power as well as digital switching noise), the combination of an ultralowpower linear regulator, temperature-stable bandgap reference, and bias current generation provides stable DC bias and supply (+1.2 V) for the chip. In addition, a potentiate offers a stable potential (+400 mV) to initiate electro-oxidation b Dimensions of μ-LED [47] between the combination of WEs and CEs (the CE2, connected to a reference sensor, is designed to block the undesired interference) or the combination of WEs and REs. The measured current signal is amplified and converts to a specific frequency through the processing of an oscillator-based current-to-frequency converter.…”

Section: Wireless Readout Chip Architecturementioning

confidence: 99%

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Glucose Sensor and Its Potential Directions

Cheng

Kuan

Chen

2015

In-Vitro Diagnostic Devices

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“…4.8) [47]. In the research reported on here, an AlAs sacrificial layer was initially stacked on the top of a GaAs substrate [28].…”

Section: Led (Red Light) Fabricationmentioning

confidence: 99%

Section: Wireless Readout Chip Architecturementioning

confidence: 99%

Glucose Sensor and Its Potential Directions

Cheng

Kuan

Chen

2015

In-Vitro Diagnostic Devices

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“…We derive the constraints on the CMOS rectifier design and impedance matching, and calculate a maximum theoretical distance of operation with a 1 W RF power source. In [6], we present a custom LED. As shown in Fig.…”

Section: System Feasibilitymentioning

confidence: 99%

“…For the micro-LEDs, aluminum gallium arsenide was chosen because of its efficient emission and established usage as an optoelectronic material. Details of the LED design, fabrication, and initial testing are provided in [6].…”

Section: Lens Fabricationmentioning

confidence: 99%

Toward an active contact lens: Integration of a wireless power harvesting IC

Pandey

Liao

Lingley

et al. 2009

2009 IEEE Biomedical Circuits and Systems Conference

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The overarching goal of an active contact lens is to integrate sensing or display functionality onto a wearable device, enabling on-lens medical monitoring and heads-up displays. We present progress toward a wirelessly-powered active contact lens comprising a transparent polymer substrate, loop antenna, power harvesting IC, and a custom micro-LED. The fully integrated radio power harvesting and a power management system was fabricated in a 0.13 μm CMOS process and utilizes a small onchip capacitor as an energy storage element to light up a micro-LED pixel. We have demonstrated wireless power transfer and LED intensity control using the custom IC and on-lens antenna.

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“…Shape recognition allows us to assemble various components, which have gone through different fabrication methods and made from different materials, on a single platform. We have fabricated free-standing silicon transistors and resistors [6], LEDs [7], and photosensors [8]. All device structures for components are built on a sacrificial layer to give us the ability to release the elements at a later stage.…”

Section: Microfabrication Of Components and Templatementioning

confidence: 99%

Automation and yield of micron-scale self-assembly processes

Saeedi

Kim

Etzkorn

et al. 2007

2007 IEEE International Conference on Automation Science and Engineering

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We present the use of self-assembly to integrate a large number of free-standing microcomponents onto unconventional substrates. The microcomponents are batch fabricated separately from different semiconductor materials in potentially incompatible microfabrication processes and integrated onto unconventional substrates such as glass and plastic. These substrates offer a number of unique attributes as compared with silicon such as transparency, flexibility, and lower cost. Here, we provide an overview of the self-assembly process, describe how microcomponents that can participate in the self-assembly process can be mass-produced, and discuss initial self-assembly experimental results. Our results indicate that even with a very simple set-up, self-assembly yields as high as 97 % for components as small as 100 µm are achievable, making the self-assembly technique immediately comparable with (or better than) the state-of-the-art robotic pick-and-place systems. We discuss various parameters that affect the yield of the self-assembly process and a possible automation scheme.

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Self-assembled inorganic micro-display on plastic

Cited by 13 publications

References 4 publications

Glucose Sensor and Its Potential Directions

Glucose Sensor and Its Potential Directions

Toward an active contact lens: Integration of a wireless power harvesting IC

Automation and yield of micron-scale self-assembly processes

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