Automation and yield of micron-scale self-assembly processes

Saeedi, E.; Kim, S.S.; Etzkorn, James R.; Meldrum, Deirdre R.; Parviz, Babak A.

doi:10.1109/coase.2007.4341776

Cited by 6 publications

(7 citation statements)

References 6 publications

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“…The first method uses gravity in combination with complementary 3D shapes to assemble trapezoidal Si dies onto plastic substrates . The second uses gravity in combination with surface‐tension‐directed‐self‐assembly either using hydrophilic/hydrophobic surface patterns or using solder‐patterned surfaces to assemble and electrically connect semiconductor dies/chiplets on surfaces with similar yields . Among all the methods that have been published the method first referenced in [22] remains the only method that has been scaled to be used in an industrial manufacturing process; the blueprints of the “self‐assembly machine”, however, has never been disclosed.…”

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confidence: 99%

A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine

et al. 2014

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A first automated reel‐to‐reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high‐speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm‐wide web) over large‐area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid‐state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.

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confidence: 99%

A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine

et al. 2014

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“…Representative fluid selfassembly is illustrated in figure 12(a). A specially designed receiver substrate is placed in a self-assembly bath at a specific angle such as ∼30 • to help the chips move gently due to gravity [221]. Once freestanding microLED chips are submerged in the liquid medium (e.g.…”

Section: Fluid Self-assemblymentioning

confidence: 99%

Mass transfer techniques for large-scale and high-density microLED arrays

Chen

Bian

et al. 2022

Int. J. Extrem. Manuf.

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Inorganic-based micro light-emitting diodes (microLEDs) offer more fascinating properties and unique demands in next-generation displays. However, the small size of microLED chip (1~100 µm) makes it extremely challenging for high efficiency and low cost to accurately, selectively integrate millions of microLED chips. Recent impressive technological advances have overcome the drawbacks of traditional pick-and-place techniques when they were utilized in the assembly of microLED display, including the most broadly recognized laser lift-off technique, contact µTP technique, laser non-contact µTP technique, and self-assembly technique. Herein, we firstly review the key developments in mass transfer technique and highlight their potential value, covering both the state-of-the-art devices and requirements for mass transfer in the assembly of the ultra-large-area display and virtual reality glasses. We begin with the significant challenges and the brief history of mass transfer technique, and expand that mass transfer technique is composed of two major techniques, namely, epitaxial Lift-off technique and pick-and-place technique. The basic concept and transfer effects for each representative epitaxial Lift-off and pick-and-place technique in mass transfer are then overviewed separately. Finally, the potential challenges and future research directions of mass transfer are discussed.

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“…Within the last years several working groups presented self-assembly processes that use capillary forces for self-alignment of silicon devices [2,3]. Most of these self-assembly techniques are working in liquid environment and require delivery of chips in overplus in order to fill all assembly sites by functional components [4,5].…”

Section: Self-assembly Of Microelectronic Componentsmentioning

confidence: 99%

“…Most of these self-assembly techniques are working in liquid environment and require delivery of chips in overplus in order to fill all assembly sites by functional components [4,5].…”

Section: Self-assembly Of Microelectronic Componentsmentioning

confidence: 99%

Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates

Landesberger

Yacoub-George

Hell

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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The paper reports on a self-assembly process that enables both self-alignment of microelectronic devices and self-interconnection of devices with the surrounding electrical wiring. The complete process was successfully demonstrated using state-of-the-art RFID devices (radio frequency identification device) which were self connected to four metal pads on polymer foil substrates.The new self-assembly concept comprises the following steps: mask-less plasma patterning process to define target areas for die assembly on polymer tapes, application and self-alignment of a liquid assembly medium at the target area, dropping of the chip device onto the assembly liquid, self-orientation of the chip with respect to the contact pads and finally heat induced bonding and interconnection of the device. Self-assembly of microelectronic componentsThe term self-assembly is generally used to identifY processes which enable objects to arrange themselves in predetermined structures.In the field of microelectronics researchers are aiming for new chip assembly principles that work independent of mechanically controlled machines such as equipments for pick and place or wire bonding. Self-assembly would help to significantly reduce cost in microelectronic packaging. Furthermore, there is also a fundamental need to look for new assembly concepts: the ongoing miniaturization in semiconductor technology and the related shrinkage in die size. Consequently, there is an increasing demand for high throughput handling of chips which have a size of just a few hundreds of micrometers.One typical example would be assembly of RFID devices in huge quantities and at a nearly evanescent cost level. A prominent example of self-assembly of functional silicon devices was introduced by the US company Alien Technologies [I]. According to their concept small silicon chips are delivered in large quantities in a constant stream of liquid which flows over a substrate that shows specific surface topography. The pyramidal shape of the silicon devices allows for a self-controlled placement of the dies at their target positions.Within the last years several working groups presented self-assembly processes that use capillary forces for self-alignment of silicon devices [2,3]. Most of these self-assembly techniques are working in liquid environment and require delivery of chips in overplus in order to fill all assembly sites by functional components [4,5].

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Automation and yield of micron-scale self-assembly processes

Cited by 6 publications

References 6 publications

A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine

A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine

Mass transfer techniques for large-scale and high-density microLED arrays

Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates

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