“…In the past years, 3D components with embedded electronics such as sensors [3,4], batteries [5] and antennas [6,7], have been fabricated successfully by using hybrid additive manufacturing (AM) technologies [8,9], which mainly consist of the 3D printing of insulators and direct writing (DW) of conformal circuits thereon. The former is usually conducted by the fused deposition modeling (FDM), stereolithography (SLA), selective laser sintering (SLS) and slurry dispensingsintering methods [10][11][12], etc, and the typical techniques of the latter are inkjet printing, dispensing, aerosol jet printing [13][14][15], etc. Tehrani et al [16] and Li et al [17] prepared the circuits on SLA-printed 3D objects by inkjet printing and micro-dispensing, respectively, by which the mm-wave wireless packaging device and embedded electronics were obtained.…”