How to recognize the shape gesture for new human-computer interface without controller required and bring entertainment, games industries and information appliances in new ways. In this paper, we would illustrate a real-time hand gesture recognition system by using shape context matching and cost matrix. The shape context is taken as a basis description for shape matching. It can be regarded as a global characterization descriptor to represent the distribution of points in a set with scale and rotation invariance. In this paper, we developed a perceptual interface for human-computer-interaction based on real-time hand gesture recognition. User could interact with computer program by performing body gesture instead of physical contact. The image of hand gesture was captured from CCD. The hand gesture image was transformed into proper instruction according to the shape information respectively. The instruction was transferred to an appropriate program to execute. The experience of our preliminary results shown the precision rates was up to 70% ~ 90%
This work proposes a facile and economical hybrid additive manufacturing (HAM)technology combining fused deposition modeling (FDM) 3D printing and laser‐activated selective electroless plating (ELP) for fabricating full functional end‐use 3D customized electronics. A functional acrylonitrile butadiene styrene (ABS) filament doped with dicopper hydroxide phosphate (Cu2(OH)PO4) catalysts is developed for FDM 3D printing. The 3D printed structure is selectively laser‐activated to generate CuI plating seeds on the ABS surface and then electrolessly plated. The poor surface finish, especially the layer lines, is an intrinsic defect of extrusion 3D printing, which not only affected the fabrication quality of the 3D substrates but also the electrical performance of the attached circuitry. Herein, a chemical polishing process based on acetone vapor is explored and characterized to significantly improve the surface quality and thereby the electrical performance of the attached copper layer. In this way, highly conductive metallic circuitry can be freeformly deposited and patterned on the 3D structure which is extremely attractive for customized 3D electronics. To show the application potential of this technology, a 3D conformal 555 timer astable oscillator circuit board and a hot‐wire flowmeter are developed as demonstrators.
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