Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

Highlights High-energy ball milling was proposed to construct oxygen vacancy defects. Scaffold with individualized shape and porous structure was fabricated by selective laser sintering. Antibacterial material was used to adsorb H2O2 to the site of bacterial infection. The accumulated H2O2 could amplify the Fenton reaction efficiency to induce more ·OH. The scaffold possessed matched mechanical properties and good biocompatibility.

Section: Preparation Of Bone Scaffoldmentioning

confidence: 99%

Oxygen vacancy boosting Fenton reaction in bone scaffold towards fighting bacterial infection

Shuai,

Shi,

Yang

et al. 2023

“…Recently, most advanced technologies for fabricating 3D inorganic complex microstructures based on femtosecond laser two-photon polymerization (fs-TPP) have been extensively investigated to achieve the goal of compactness, lightweight, and miniaturization in the manufacturing process [11][12][13]. The fs-TPP is a cutting-edge direct writing technology, which can surpass the optical diffraction limit to achieve subwavelength spatial resolution [14][15][16][17][18][19][20][21]. It stands as a novel approach for high-precision fabrication.…”

Section: Introductionmentioning

confidence: 99%

Isotropic sintering shrinkage of 3D glass-ceramic nanolattices: backbone preforming and mechanical enhancement

Chai,

Yue,

Chen

et al. 2024

There is a perpetual pursuit for free-form glasses and ceramics featuring outstanding mechanical properties as well as chemical and thermal resistance. It is a promising idea to shape inorganic materials in three-dimensional (3D) forms to reduce their weight while maintaining high mechanical properties. A popular strategy for the preparation of 3D inorganic materials is to mold the organic-inorganic hybrid photoresists into 3D micro- and nano-structures and remove the organic components by subsequent sintering. However, due to the discrete arrangement of inorganic components in the organic-inorganic hybrid photoresists, it remains a huge challenge to attain isotropic shrinkage during sintering. Herein, we demonstrate the isotropic sintering shrinkage by forming the consecutive -Si-O-Si-O-Zr-O- inorganic backbone in photoresists and fabricate 3D glass-ceramic nanolattices with enhanced mechanical properties. The femtosecond (fs) laser is used for two-photon polymerization (TPP) to fabricate 3D green body structures. After subsequent sintering at 1000 ℃, high-quality 3D glass-ceramic microstructures can be obtained with perfectly intact and smooth morphology. In-suit compression experiments and finite-element simulations reveal that octahedral-truss (Oct-Truss) lattices possess remarkable adeptness in bearing stress concentration and maintain the structural integrity to resist rod bending, indicating that this structure is a candidate for preparing lightweight and high stiffness glass-ceramic nanolattices. 3D printing of such glasses and ceramics has significant implications in a number of industrial applications, including metamaterials, microelectromechanical systems, photonic crystals, and damage-tolerant lightweight materials.

“…Direct conformal printing technology provides a fast, reliable, and simple method for the realization of curved surface electronics and functional circuits with a 3D free-form surface [16][17][18][19]. However, because of technical limitations, it is currently only suitable for printing micro-or even millimeter scale structures.…”

Section: Introductionmentioning

confidence: 99%

Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates

Shu,

Feng,

Liu

et al. 2023

There is an urgent need for novel processes that can integrate different functional nanostructures onto specific substrates, so as to meet the fast-growing need for broad applications in nanoelectronics, nanophotonics, and flexible optoelectronics. Existing direct-lithography methods are difficult to use on flexible, nonplanar, and biocompatible surfaces. Therefore, this fabrication is usually accomplished by nanotransfer printing. However, large-scale integration of multiscale nanostructures with unconventional substrates remains challenging because fabrication yields and quality are often limited by the resolution, uniformity, adhesivity, and integrity of the nanostructures formed by direct transfer. Here, we proposed a resist-based transfer strategy enabled by near-zero adhesion, which was achieved by molecular modification to attain a critical surface energy interval. This approach enabled the intact transfer of wafer-scale, ultrathin-resist nanofilms onto arbitrary substrates with mitigated cracking and wrinkling, thereby facilitating the in situ fabrication of nanostructures for functional devices. Applying this approach, fabrication of three-dimensional-stacked multilayer structures with enhanced functionalities, nanoplasmonic structures with ∼10 nm resolution, and MoS2-based devices with excellent performance was demonstrated on specific substrates. These results collectively demonstrated the high stability, reliability, and throughput of our strategy for optical and electronic device applications.