“…The Ferroelectric SBT films gather many advantage in characteristics over other ferroelectric compounds, for application in ferroelectric memory which include a fatigue-free behavior, good retention properties and low leakage currents [Paz de Araujo, C.A., etc., (1995)]. But they require a high temperature annealing (700 o C~800 o C) for crystallization that is main cause of constituent-element diffusion from the ferroelectric film into and the insulator layer in Pt/SBT/SiO 2 /n-Si MFIS structure [Kim, W. S., (2002), Li, Y., [Kim, W. S., etc., (2002), Li, Y., etc., (2007), Aguilar, G. G., etc., (2006)]. Therefore, Pt/SBT/SiO 2 /n-Si MFIS structure could not give good characteristics without any treatment processes and be used for any ferroelectric memory devices.…”