Role of p-Hydroxybenzhydrazide Additive in Electrodeposition of Thin NiP Film Used as a Nonmagnetic Spacer in Laminated (CoFe/NiP) Nano Structures

Abstract

Electrodeposition of NiP film used as a thin nanomagneic spacer in laminated multilayer (2.4T CoFe/NiP) n perpendicular writer pole for recording magnetic heads is described. The electrodeposition of laminated multilayers was carried out in a dual-bath automated electroplating tool. The thin NiP films with thickness from 2 to 5 nm were obtained as nonmagnetic amorphous NiP alloys with P-content higher than 18 at. %. The problem of composition gradient at the CoFe/NiP interface was solved by using a p-hydroxybenzhydrazide organic additive in the plating solution. The details of the electrodeposition of NiP films, the role of p-HBHy and properties of electrodeposited NiP films and CoFe/NiP multilayers are discussed.

Controlled Electrodeposition and Magnetic Properties of Co35Fe65Nanowires with High Saturation Magnetization

“…Unfortunately, some complexing organic non-saccharin additives in electrodeposition of TM alloys, caused more than 40% decrease of B s -value due to the incorporation of oxygen compounds into the deposit. [34][35][36][37] Use of ascorbic acid (AA) as a reducing agent for Fe +3 ions in the preparation of CoFe nanowires, [15][16][17][18][19][20][21][22][23][24][25][26] is efficient for deaerated plating solution in the short term. However, over longer times accumulated dehydroascorbic acid (DHAA), formed in the redox reaction, is subjected to hydrolysis giving rise to several possible bidentate nucleophiles.…”