Resist Heating in Cell Projection Electron Beam Direct Writing

Abstract

Electron beam (EB) direct writing systems have often been used for fabricating sub-half-micron advanced devices because EB direct writing is the most practical method for making the required patterns. Recently, the cell projection (CP) method has become indispensable for increasing the writing throughput in the EB direct writing system. However, it is considered that resist heating may be seriously aggravated below the quarter-micron level when the CP method is used, because the total deposited energy, which is irradiated by one CP EB shot, is almost the same as that irradiated by one variably shaped (VS) EB maximum size shot. Resist heating in the case of the CP method is calculated by a finite element method using the ANSYS (Ver. 5.0A: ANSYS, Inc.) program. In particular, thermal diffusion calculation is mainly carried out under the conditions of 50 kV acceleration voltage and 10 A/cm2 current density for practical application to advanced device fabrication. The calculated results suggest that resist heating in the CP method is mainly caused by the horizontal thermal flux between plural EB shots within the area of one CP shot, by the same mechanism as proximity resist heating under the VS method. Therefore, CP EB writing causes horizontal-mode resist heating. In particular, when a low current density is used, this resist heating mode arises significantly. However, CP writing with high acceleration voltage causes a reduction in the rise of the resist temperature, which causes resist heating. When the EB irradiation time is longer than 1.0 µ s under practical EB writing conditions, the resist temperature increases proportionally to the decrease of writing pattern size in the case of the CP writing with a maximum shot size of 5.0×5.0 µ m. It is also shown that the larger the beam blur of an incident beam, the more serious is the resist heating. When a highly sensitive resist (10 µ C/cm2) is used under these practical conditions, however, resist heating in the CP method is prevented without writing throughput degradation regardless of the CP maximum shot size, because the resist temperature does not rise above the thermal denaturation temperature of standard EB resists. Accordingly, the maximum CP shot size, which affects the writing throughput, is determined by the proximity effect and the Coulomb interaction for fine pattern fabrication.

Theoretical study on effects of electron thermal energy on sensitization process of chemically amplified electron beam resists—contribution to resist heating effect in electron beam mask writing

“…This resist pattern deformation is called a resist heating effect. 1,[3][4][5][6][7][8][9][10][11][12][13][14][15][16] The temperature rise has been experimentally and theoretically investigated. The resist deformation caused by the temperature rise has also been experimentally and theoretically investigated.…”

Finite element analysis of SCALPEL wafer heating

“…The relatively large SCALPEL subfield area avoids the severe concentration of heating power seen in direct write and cell-projection electron-beam lithography approaches, 5 and affords exposure times which are orders of magnitude longer. The depth of beam penetration into the substrate, and the high substrate thermal conductivity, means that the severe resist heating effects seen in some mask-writing scenarios are avoided.…”