2017
DOI: 10.3390/computers6020016
|View full text |Cite
|
Sign up to set email alerts
|

Reliability of NAND Flash Memories: Planar Cells and Emerging Issues in 3D Devices

Abstract: Abstract:We review the state-of-the-art in the understanding of planar NAND Flash memory reliability and discuss how the recent move to three-dimensional (3D) devices has affected this field. Particular emphasis is placed on mechanisms developing along the lifetime of the memory array, as opposed to time-zero or technological issues, and the viewpoint is focused on the understanding of the root causes. The impressive amount of published work demonstrates that Flash reliability is a complex yet well-understood … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
22
0

Year Published

2018
2018
2022
2022

Publication Types

Select...
6
3

Relationship

0
9

Authors

Journals

citations
Cited by 69 publications
(22 citation statements)
references
References 334 publications
0
22
0
Order By: Relevance
“…Figure 1(a) presents the impact of such retention errors in terms of bit error rates (BER) in 3D NAND (CT-flash) normalized to that in 2D NAND (FG-flash). In this figure, the 2D NAND curve represents the well-known trend for FG-Flash devices [35], while the 3D NAND data are derived using our proposed analytic model for similar process technology and parameters and verified against available data [7,9,16]. One can notice from the figure that while 2D NAND starts to suffer from high BER only near the end of its retention period (∼10 years), 3D NAND can experience around 70% of the peak BER only months after a program.…”
Section: Introductionmentioning
confidence: 90%
“…Figure 1(a) presents the impact of such retention errors in terms of bit error rates (BER) in 3D NAND (CT-flash) normalized to that in 2D NAND (FG-flash). In this figure, the 2D NAND curve represents the well-known trend for FG-Flash devices [35], while the 3D NAND data are derived using our proposed analytic model for similar process technology and parameters and verified against available data [7,9,16]. One can notice from the figure that while 2D NAND starts to suffer from high BER only near the end of its retention period (∼10 years), 3D NAND can experience around 70% of the peak BER only months after a program.…”
Section: Introductionmentioning
confidence: 90%
“…2 (a), which reduces the burden of circuits. In addition, program inhibition by boosting the channel potential is used to program only one cell in a row by applying a high bias to the unselected bit-lines and a low bias to the selected bit-line [15].…”
Section: Operation Scheme Of Multi-layer Neural Networkmentioning
confidence: 99%
“…Venkatesan [36] discussed the fundamentals and electron properties of 3D NAND Flash from the view of fabrication process integration and equipment engineering. References [11,37,38] compared 2D NAND Flash and 3D NAND Flash in terms of physical structure and working principle, and analyzed the advantages and problems brought by 3D technology. Seo [39] studied the interference between flash cells in terms of the composition of 3D NAND Flash cells.…”
Section: Related Workmentioning
confidence: 99%