Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints

Steiner, František; Wirth, Vaclav; Hirman, Martin

doi:10.1109/isse.2019.8810303

Cited by 15 publications

(7 citation statements)

References 3 publications

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“…), components (geometry, shape, terminal oxidation, etc.) and the process (thickness, the shape and the parameters of the solder paste's printed layer, temperature profile) [22][23][24][25][26]. An example of macrovoids in the solder joints of a soldered BGA package on the PCB is given in Figure 18.…”

Section: Macrovoidsmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

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The formation of defects and imperfections in the soldering process can have many causes, which primarily include a poorly setup technological process, inappropriate or inappropriately used materials and their combinations, the effect of the surroundings and design errors. This chapter lists some examples of errors that can occur in soldering, while review is devoted to selected defects: non-wettability of the solder pads, dewetting, wrong solder mask design, warpage, head-in-pillow, cracks in the joints, pad cratering, black pad, solder beading, tombstoning, dendrites, voids, flux spattering from the solder paste, popcorning and whiskers.

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Section: Macrovoidsmentioning

confidence: 99%

Overview of Selected Issues Related to Soldering

Dusek¹,

Busek²,

Veselý³

2021

Welding - Modern Topics

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“…They have a negative influence on all types of interconnections mentioned above and thus pose a certain degree of reliability risk. The study by Steiner et al [1] shows that voids in solder joints significantly influence the joint's mechanical strength. The larger the void area in the joint, the more the mechanical strength of the joint decreases.…”

Section: Introductionmentioning

confidence: 99%

“…Based on literature research, the presented approaches are novel, and the impact of using them against the voiding issue was not described and analyzed in detail anywhere else. Effects on void occurrence in solder joints that have been investigated in other studies include, for example, changing the type of surface finish of solder pads or temperature profiles of reflow changing, where the authors suggest that up to approximately 5% improvement can be achieved [1]. Furthermore, the particle size of the solder alloy was investigated in the previous study, yielding an improvement of around 2% [24].…”

Section: Introductionmentioning

confidence: 99%

Analysis of solder mask roughness and stencil shape influence on void formation in solder joints

2023

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Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first approach is the change of the roughness of the solder mask to influence the flux spreading around the solder pad. The second approach is the deposition of the same volume of the solder paste to the solder pads using a modified, thicker stencil with smaller apertures. The experiments were performed for solder pastes containing SAC305 alloy and two types of fluxes (ROL0/ROL1). Solder joints were inspected by X-ray imaging, and the shots were subsequently processed by image analysis. For determination of the spreading area of the flux around the solder pad during the reflow process, the tested boards were scanned by a confocal digital microscope. The results showed that more aggressive flux caused less voiding in terms of the average area of voids covering the soldering pad. Analysis of samples prepared with modified stencils showed a much lower proportion of voids than with the standard stencil. Furthermore, the results revealed that the selection of the solder mask type significantly influenced the voids’ formation within solder joints in the case of the unmodified stencil for solder paste deposition. On the other hand, when the modified stencils were used for sample preparation, the solder mask had no further impact on voiding. Therefore, modifying the stencil can be pointed out as a preferable and effective way.

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“…The changeover was not straightforward; the reflow profile became more difficult to set appropriately because of the smaller difference in temperature between the onset of alloy melting and the heat resistance of components [ 4 ]. Additionally, the lead-free alloys that were initially developed exhibited lower performance than the conventional lead-bearing solders from both mechanical and reliability points of view [ 5 ].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

et al. 2020

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Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20–25 N) compared with the SAC305 alloy (27–35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder–substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

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Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints

Cited by 15 publications

References 3 publications

Overview of Selected Issues Related to Soldering

Overview of Selected Issues Related to Soldering

Analysis of solder mask roughness and stencil shape influence on void formation in solder joints

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

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