Overview of Selected Issues Related to Soldering

Dusek, Karel; Busek, David; Veselý, Petr

doi:10.5772/intechopen.91023

Cited by 6 publications

(3 citation statements)

References 21 publications

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“…With the reduced pitch between leads and repeated soldering, reliability issues can arise, such as the formation of conductive bridges (shorts) leading to non-functional devices. Moreover, a decreased pitch between leads can cause the faster growth of dendrites, which can ultimately result in device failure as was shown in studies [ 1 , 2 , 3 , 4 , 5 , 6 ].…”

Section: Introductionmentioning

confidence: 99%

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Sorokina,

Dušek,

Bušek

2024

Materials

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This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements. The study focused on two types of solders: Sn63Pb37 as a reference, and the commonly used SAC305, with measurements taken at various temperatures. The BGA samples were subjected to three different heating/cooling cycles in a thermomechanical analyzer (TMA) at temperatures of 250 °C, 280 °C, and 300 °C, with a subsequent cooling down to 100 °C. The results obtained from the TMA indicated differences in the collapse behavior of both BGA solder alloys at various temperatures. Short circuits between neighboring leads (later confirmed by an X-ray analysis) were also recognizable on the TMA. The novel approach was successfully developed and applied, yielding clear insights into the behavior of solder balls during repeated reflow.

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Section: Introductionmentioning

confidence: 99%

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Sorokina,

Dušek,

Bušek

2024

Materials

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“…Other factors that affect the growth rate of whiskers are humidity and operating temperature, solder composition, contamination, etc. [14,15]. The next mechanism that can lead to the failure of an electric device is the formation of voids.…”

Section: Introductionmentioning

confidence: 99%

“…The formation of voids leads to increased resistance of the joint and an increase in the current density flowing through the solder. This can cause local overheating and further damage to the circuit [15,16].…”

Section: Introductionmentioning

confidence: 99%

Accelerated Testing and Reliability of FDM-Based Structural Electronics

Wałpuski

Słoma

2022

Applied Sciences

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With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded into its mechanical construction. This approach has many advantages, but the reliability of systems constructed this way has not been extensively studied so far. In this work, circuits consisting of silver ink conductive traces were printed on FDM polymer substrates, with or without 0 Ω resistors, and were subjected to accelerated aging testing. The samples were divided into three groups, and for each of them, the mean time to failure was calculated, which for the best group was 8000 h. This paper also presents the mechanism that led to the failure of these systems, as well as actions that will lead to the elimination of this phenomenon.

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