A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation
Kristina Sorokina,
Karel Dušek,
David Bušek
Abstract:This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements. The study focused on two types of solders: Sn63Pb37 as a reference, and th… Show more
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