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Purpose The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fishbone diagram. Subsequently, the experiment was designed. Seven types and three volume of solder pastes and two aperture shapes of the stencil were used. The measured parameters were mechanical strength, electrical resistance, voids area and intermetallic compound (IMC) thicknesses. The results of the experiment were evaluated and recommendations for practice were defined. Findings The carried out research has confirmed the influence of solder paste quantity on the shear strength, electrical resistance, voids area and IMC thickness of solder joint. The article presents the results achieved for solders Sn42Bi58, Sn42Bi57.6Ag0.4, SnAg3.0Cu0.5, SnCu0.7Ag1.0NiGe, SnAg3.5Bi0.5In8.0 and Sn62.5Pb36.5Ag1.0. Reduction of solder paste quantity down to 74 per cent (i.e. one quarter of quantity) decreases mechanical shear strength less than 10 per cent. Recommendations relating to the optimal reduction of solder paste quantity have been designed for each solder paste. Originality/value Contribution of the paper is impact assessment of solder paste quantity on the properties of the soldered joint. It was carried out a large number of experiments and measurements which verify this effect. Such a comprehensive overview of the results is not yet available in the literature. Recommendations for manufacturers of electronic assemblies are also the benefit of article.

Dynamic changes and increasing competition in global markets have caused changes in the management of small and medium enterprises (SMEs). Due to this fact, many SME companies try to implement different methods for strategy and operation management, quality and improvement management, risk management, etc. But the problem is the efficiency and implementation of these methods in the SME company. One way to achieve higher efficiency is the integration of management methods, meaning the combination of performance management with quality, process and risk management. This approach is also recommended in the ISO standards for quality. It was reflected in a new revision of the ISO 9001 standards in the year 2015. Performance can be described by the financial and non-financial key performance indicators (KPI), covering the cost, quality and time indicators that have been implemented in the balanced scorecard framework (BSC). The aim of this chapter is to present a methodological framework, which leads to the integration of the key performance indicators (KPI) in relation to the key risk indicators (KRI), which may affect the KPIs and overall SME performance. This framework combines a process analysis and modelling with risk and qualitative or quantitative risk assessment techniques. The case study describes its practical implementation and the verification of the designed framework. The results of this research will help to build an effective management system for performance and risk management and quality management for the business processes of SMEs.