2012 IEEE First AESS European Conference on Satellite Telecommunications (ESTEL) 2012
DOI: 10.1109/estel.2012.6400164
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Radiation hardened 2Mbit SRAM in 180nm CMOS technology

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Cited by 11 publications
(5 citation statements)
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“…In this case, many contributions can be distinguished, but the main ones are the latch-up of the circuits and the single event effects (SEE). Some of these effects can be avoided by properly designing the circuits using radiation hardening-by-design techniques [8] - [9]. This is not the case for DDD effects related to the damaging of the crystalline structure of the substrate.…”
Section: Radiation Effects On Cmos and S-flash Cellmentioning
confidence: 97%
See 1 more Smart Citation
“…In this case, many contributions can be distinguished, but the main ones are the latch-up of the circuits and the single event effects (SEE). Some of these effects can be avoided by properly designing the circuits using radiation hardening-by-design techniques [8] - [9]. This is not the case for DDD effects related to the damaging of the crystalline structure of the substrate.…”
Section: Radiation Effects On Cmos and S-flash Cellmentioning
confidence: 97%
“…The used RHBD approach is divided into three levels -architectural, schematic and layout-addressing different solutions to radiation effects. From the point of view of the memory periphery a RHBD approach has been considered as in the previous works related to rad-hard SRAM memories [9]. From the point of view of the S-Flash cell, a similar approach has been considered to enhance the radiation hardness of the design.…”
Section: Memory Architecture Radiation Enhancementmentioning
confidence: 99%
“…2). This arrange ment is suit able, for ex am ple, for test ing the rad-hard mem o ries [11][12][13].…”
Section: The Test Meth Od Ol Ogy De Vel Op Mentmentioning
confidence: 99%
“…Since, the chip is divided into blocks the case is reduced to single bit being affected. And the affected byte is recovered using ECC [44].The schematic level hardening is achieved by decreasing the number of floating gates, restricting the pass transistor and increasing the parasitic capacitance. At layout level edgeless transistors are used to avoid thick oxides.…”
Section: Cmos Srammentioning
confidence: 99%