Preparation and Electrical Properties of Sol–Gel Derived Lead Zirconate Titanate Glass-Ceramic Thin Films on Metal Foil Substrates

Abstract

We derive a new method for initial-state collinear showering in Monte-Carlo event generators which is based on the use of unintegrated parton correlation functions. Combined with a previously derived method for final-state showering, the method solves the problem of treating both the hard scattering and the evolution kernels to be used in arbitrarily non-leading order. Although we only treat collinear showering, so that further extensions are needed for QCD, we have discovered several new results: (1) It is better to generate exact parton kinematics in the hard scattering rather than with the subsequent parton showering, and similarly at each step of the showering. (2) Parton showering is then done conditionally on the exact energy-momentum of the initiating parton. (3) We obtain a factorization for structure functions in terms of parton correlation functions so that parton kinematics can be treated exactly from the beginning. (4) We obtain two factorization properties for parton correlation functions, one in terms of ordinary parton densities and one, suitable for event generation, in terms of parton correlation functions themselves.

Effects of barrier layers on the electrical properties of (Pb,La)(Zr,Ti)O3 films on nickel foils

“…Values of the relative permittivities and dielectric losses of PLZT on nickel were reasonable compared to the literature reports [2][3][4]. It can be seen from Fig.…”

“…Thin film technologies can also reduce the device footprints and permit the integration directly onto the circuitry. Although several groups have explored this approach, development of thin film integration on base metals has been complicated by several factors such as oxidation of the base-metal bottom electrode, oxygen vacancy-related increases in dielectric loss, or suppression of film dielectric constants [1][2][3][4][5][6]. Therefore, electrical properties of ferroelectric materials deposited on foil substrates show much lower values compared to films deposited on platinized silicon substrates.…”

Copper Compatible Barium Titanate Thin Films for Embedded Passives

“…Though low loss, high capacitance density material can be prepared on Pt surfaces, this technology is not appropriate for embedded passives given the high cost of Pt, the inherent rigidity of typical silicon substrates, and the large series resistance associated with thin Pt electrodes. As an alternative approach, several groups have pursued preparation of high permittivity perovskite dielectrics on thin metal foils [7][8][9]. The refractoriness and flexibility of the foils provides a substrate amenable to lamination-based embedding, while maintaining compatibility with oxide thin film processing.…”

Influence of nitrogen annealing on electrical properties of lead zirconate titanate thin film deposited on titanium metal foil

“…Most PZT films are currently deposited on silicon substrates (with a Pt bottom electrode), limiting their range of potential applications. In order to permit a broader range of potential applications, several recent reports have described attempts at depositing dielectric films on other substrates including pure metals (e.g., Ag and Ti) and metallic alloys (e.g., TiNi, brass, nickel alloy and stainless steel) [5][6][7][8][9]. Advantages of such structures include high frequency operation, low dielectric loss, low electrical series resistance, and the potential for embedded capacitor system [8].…”