1995 Proceedings. 45th Electronic Components and Technology Conference
DOI: 10.1109/ectc.1995.517768
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Polyimide stress cushion for multichip glass-ceramic module packaging

Da‐Yuan Shih
1
,
P. Palmateer
2
,
Yu Fu
3
et al.
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Cited by 3 publications
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MCM-D/C packaging solution for IBM latest S/390 servers

Perfecto
1
,
Shields2,
Malhotra3
et al. 2000
IEEE Trans. Adv. Packag.
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MCM-D/C packaging solution for IBM latest S/390 servers

Perfecto
1
,
Shields2,
Malhotra3
et al. 2000
IEEE Trans. Adv. Packag.
6
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1
0
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Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling

Zhou
1
,
He
2
,
WeiDai
3
et al. 2011
2011 IEEE 13th Electronics Packaging Technology Conference
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MCM-D/C packaging solution for IBM latest S/390 servers

Perfecto
1
,
Shields2,
Jeanneret3
et al.
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH840
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