Multi-chip modules using deposited dielectric materials (MCM-D) have been produced at IBM Microelectronics Packaging Facility for over a decade. To take full advantage of this package, ZBM uses flip chip technology to minimize the required substrate and silicon active area. The terminal or bonding metals for chip to substrate interconnection have been deposited by a variety of methods including electroplating and electroless plating combinations, and recently, stencil lift-off &IO) of evaporated film. Here, the Cr/Cu/Ni/Au metallurgy was deposited not only on the interconnecting pad areas, but also on the redistribution lines. A selective deposition process was developed to eliminate the metal on the lines. Two terminal metallurgies were evaluated by this selective process, namely Cr/Cu/Ni/Au and CrlCuIColAu. This paper will cover interconnection aspects with respect to materidsolder interaction of the IBM Controlled Collapse Chip Connection (C4) process with 97Pbl3Sn solder and wire bonding as practiced on terminal metal pads fabricated by a selective deposition process. Reliability evaluation of this new process and CO metallurgy will also be discussed.
The addition of water results in the higher wear rate of gold compared to experiments performed in the ambient environment (approximately 60% humidity). This higher wear rate in water has been observed with the AFM, Hysitron Triboindenter, and additionally in single pass scratch tests performed with the Taber Shear/Scratch tester. These tests were preformed using silicon nitride cantilevers in the AFM and a diamond tip in Hysitron and in the Taber instrument. Tests performed in the ambient atmosphere resulted in slightly reduced surface roughness, while much higher wear rate was observed in water. Ambient scratch tests consistently produced slightly shallower scratch trenches than wet scratches as a function of increasing normal load. Single scan lines provide valuable information about the mechanisms and progression of the nanoscale wear. The different components of scratch friction are investigated to explore the main contributors to the nanoscale scratching of gold.
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