2011 IEEE 13th Electronics Packaging Technology Conference 2011
DOI: 10.1109/eptc.2011.6184505
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Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling

Jing Zhou
1
,
Ruixia He
2
,
Feng WeiDai
3
et al.
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Cited by 4 publications
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Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

Chen1,
Yu2,
Huang3
et al. 2013
Microelectronics Reliability
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Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners

Chen1,
Yu2,
Huang3
et al. 2013
Microelectronics Reliability
17
0
5
0
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Investigation on the properties and processability of polymeric insulation layers for through silicon via

Zhao
1
,
Zhang
2
,
Peng
3
et al. 2013
2013 IEEE 63rd Electronic Components and Technology Conference
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Thermo-mechanical Stress of underfilled 3D IC packaging

Wang
1
,
Wu
2
2014
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and
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