2018
DOI: 10.1109/jstqe.2018.2854542
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Photonic Integration With Epitaxial III–V on Silicon

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Cited by 119 publications
(65 citation statements)
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“…Despite the great efforts that have been devoted on heterogeneous integration of PC lasers on Si [25][26][27] , the monolithic integration is the most promising approach for a higher yield, higher density and scalability for III-V PC lasers integrated on Si platforms, which will further increase density and yield of fabricated laser compared with III-V ridge-waveguide lasers and bonded III-V PC lasers on Si [28][29][30] . Moreover, the monolithic integration is an ideal solution to reduce the substrate cost by growing III-V materials on large-scale Si wafers, instead of using dedicated and expensive GaAs and InP wafers [31][32][33][34] .…”
mentioning
confidence: 99%
“…Despite the great efforts that have been devoted on heterogeneous integration of PC lasers on Si [25][26][27] , the monolithic integration is the most promising approach for a higher yield, higher density and scalability for III-V PC lasers integrated on Si platforms, which will further increase density and yield of fabricated laser compared with III-V ridge-waveguide lasers and bonded III-V PC lasers on Si [28][29][30] . Moreover, the monolithic integration is an ideal solution to reduce the substrate cost by growing III-V materials on large-scale Si wafers, instead of using dedicated and expensive GaAs and InP wafers [31][32][33][34] .…”
mentioning
confidence: 99%
“…As a result, Ge-on-Si has become a well-developed platform for photonic integrated circuits [43]. Today, many foundries offer complete suites of technologies based on this platform, including the American Institute for manufacturing Integrated Photonics (AIM Photonics), IMEC, GlobalFoundries, Institute of Microelectronics (IME), STMicroelectronics, Taiwan Semiconductor Manufacturing Company (TSMC), and TowerJazz [44].…”
Section: Ge-on-si Photodiode Arraysmentioning
confidence: 99%
“…A detailed techno-economic analysis of the benefits of epitaxial integration is the subject of Ref. 19.…”
Section: Introductionmentioning
confidence: 99%
“…Relative to Si, non-nitride III-V materials have larger lattice constants and higher coefficients of thermal expansion (see Table II) which, for unoptimized growth conditions, result in high densities (∼10 9 cm 2 ) of crystalline defects including primarily threading dislocations (TDs) and antiphase domains. Fortunately, through careful optimization of growth conditions and utilization of dislocation filtering layers and techniques, [19][20][21][22] the defect density can be reduced by a few orders of magnitude enabling near native substrate level performance.…”
Section: Introductionmentioning
confidence: 99%