Digest. International Electron Devices Meeting,
DOI: 10.1109/iedm.2002.1175993
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Performance enhancement on sub-70 nm strained silicon SOI MOSFETs on ultra-thin thermally mixed strained silicon/SiGe on insulator (TM-SGOI) substrate with raised S/D

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Cited by 19 publications
(7 citation statements)
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“…The performance benefits of combining strained silicon with an SOI has been demonstrated in a 60 nm gate-length, n-channel MOSFET with ultrathin thermally mixed strained silicon/SiGe on insulator sub- strate (strain-Si on insulator SSOI, SiGe on insulator SGOI). 20-25% device enhancement is demonstrated at short channel length [405]. Hole mobility can also be improved by large amounts of tensile strain.…”
Section: Strained Simentioning
confidence: 93%
“…The performance benefits of combining strained silicon with an SOI has been demonstrated in a 60 nm gate-length, n-channel MOSFET with ultrathin thermally mixed strained silicon/SiGe on insulator sub- strate (strain-Si on insulator SSOI, SiGe on insulator SGOI). 20-25% device enhancement is demonstrated at short channel length [405]. Hole mobility can also be improved by large amounts of tensile strain.…”
Section: Strained Simentioning
confidence: 93%
“…Strained silicon (Si) field effect transistors (FETs) have recently been proposed [1][2][3][4][5][6][7][8][9][10]. Their driving capability is superior to that of the pure Si-based FETs.…”
Section: Introductionmentioning
confidence: 99%
“…SOI technology has been proposed as the next technology enabling the continuity of Moore's law [1]. The emergent generalization of SOI technology can be seen recently in the literature [2,3].…”
Section: Introductionmentioning
confidence: 99%