Palladium adsorbing properties of UV-curable chitosan derivatives and surface analysis of chitosan-containing paint

Renbutsu, Eiko; Okabe, Satoko; Omura, Yoshihiko; Nakatsubo, Fumiaki; Minami, Saburo; Shigemasa, Yoshihiro; Saimoto, Hiroyuki

doi:10.1016/j.ijbiomac.2007.10.025

Cited by 14 publications

(9 citation statements)

References 11 publications

(15 reference statements)

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“…Although some substances naturally possess ligand functional groups as an integral part of their structure − , most polymers and materials useful as electronics substrates do not. Consequently, ligand functional groups must first be created on their surfaces to enable catalysis via our Sn-free Pd method.…”

Section: El Metal Depositionmentioning

confidence: 99%

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

Zabetakis

Dressick

2009

ACS Appl. Mater. Interfaces

114

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The fabrication of electrical interconnects to provide power for and communication with computers as their component complementary metal oxide semiconductor (CMOS) devices continue to shrink in size presents significant materials and processing compatibility challenges. We describe here our efforts to address these challenges using top-surface imaging and hybrid photoresist/self-assembled monolayer patterning approaches, in conjunction with selective electroless metal deposition, to develop processes capable of fabricating appropriate submicron and nanoscale metal features useful as electrical interconnects, as well as plasma-etch-resistant masks and metal diffusion barriers. Our efforts focus on the development of cost-effective methods compatible with a manufacturing environment that satisfy materials and process constraints associated with CMOS device production. We demonstrate the fabrication of approximately 50-nm-width features in metal with high fidelity and sufficient control of edge acuity to satisfy current industry design rules using our processes and discuss the challenges and opportunities for fabrication of analogous sub-10-nm metal features.

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Section: El Metal Depositionmentioning

confidence: 99%

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

Zabetakis

Dressick

2009

ACS Appl. Mater. Interfaces

114

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“…Above all, more and more monomers could react with the free amine groups on deacetylated chitosan units by RAFT polymerization [18], high-intensity ultrasound technology [22], and immobilization of complexing agents [23]. The modified chitosan derivatives could be used as sunscreen in the cosmetics because they had the benzene groups or the UVabsorption groups [24,25]. The chitosan derivatives might be used as biomaterials owing to the water-solubility.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of photosensitive chitosan derivatives(1)

Qian

Yang

et al. 2010

International Journal of Biological Macromolecules

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“…The Pd 3d XPS spectra ( Fig. 1) indicated that after the treatment with Ag 2 O, Pd 0 (corresponding to the peak at 335.3 eV, spectrum (a)) was completely oxidated to Pd 2þ (corresponding to the peak at 336.6 eV, spectrum (b)) [22]. Furthermore the Ag 3d XPS spectra in Fig.…”

Section: Mechanism Of the Reactionmentioning

confidence: 96%

1,3-Diynes synthesis by homo-coupling of terminal alkynes using a Pd(PPh3)4/Ag2O simple catalyst system

Feng

Zhao

Yang

et al. 2011

Journal of Organometallic Chemistry

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Palladium adsorbing properties of UV-curable chitosan derivatives and surface analysis of chitosan-containing paint

Cited by 14 publications

References 11 publications

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

Synthesis and properties of photosensitive chitosan derivatives(1)

1,3-Diynes synthesis by homo-coupling of terminal alkynes using a Pd(PPh3)4/Ag2O simple catalyst system

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