2019 34th Symposium on Microelectronics Technology and Devices (SBMicro) 2019
DOI: 10.1109/sbmicro.2019.8919309
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Output conductance at saturation like region on Line-TFET for different dimensions

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Cited by 5 publications
(10 citation statements)
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“…They are well-suited for use in analog/radio frequency (RF) applications due to their higher intrinsic gain and lower output conductance. 22 Figure 8 shows the intrinsic gain (A i ) of the device as the ratio between gm and g d . In order to have great results with analog signals, it is important to have a high intrinsic gain.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…They are well-suited for use in analog/radio frequency (RF) applications due to their higher intrinsic gain and lower output conductance. 22 Figure 8 shows the intrinsic gain (A i ) of the device as the ratio between gm and g d . In order to have great results with analog signals, it is important to have a high intrinsic gain.…”
Section: Resultsmentioning
confidence: 99%
“…31 Analog/RF performance.-This section is dedicated to a complete analysis of analog/RF performance. In addition to the previously discussed fundamental analog characteristics, the cutoff frequency (f T ), transit time (τ), gain bandwidth product (GBP), transconductance generation factor (TGF), and transconductancefrequency product (TFP), 20,[22][23][24][25][26] project a significant perception of the performance of the analog/RF system.…”
Section: Resultsmentioning
confidence: 99%
“…Source-to-drain tunneling plays a significant role in the entire transfer characteristics of the Line-TFET and not only in the OFF-state leakage current. This tunneling happens through the short channel point-TFET formed by the P-i-N junction composed of the source-intrinsic-drain region interfaces with channel length equal to Lsd, as shown in figure 1(a) [16]. In order to further explore this phenomenon, the device is simulated by the TCAD program Sentaurus with gate length Lg=1 μm, pocket thickness tpocket=6 nm, source-to-drain separation Lsd=25 nm and uniform pocket doping of 1 × 10 19 cm −3 (boron).…”
Section: Gate Length Variationmentioning
confidence: 99%
“…Figures 5(a) and (b) indicate that this leakage current is highly dependent on Vds and could be significant if line tunneling gets too faint. Figure 5(c) shows that the parasitic point-TFET responsible for this current is a short channel transistor that suffers from high drain induced barrier thinning (DIBT) [16], similarly to what was previously reported [17]. While increasing Lsd would reduce source-todrain tunneling, allowing operation at lower bias voltages with smaller gate lengths and also improving gd, it must be limited to values smaller than about 40 nm to avoid a significant increase in the device's inner resistance, once this is a high resistivity region.…”
Section: Gate Length Variationmentioning
confidence: 99%
“…Valor não exato devido a modulação de canal 4. Valor não exato devido a saturação da velocidade de portadores 5. Considerando Vin ≈ Vincm (ponto de terra virtual)…”
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