Optimum control of microprocessor throughput under thermal and energy saving constraints

Gołda, Adam; Kos, Andrzej

doi:10.1016/j.microrel.2012.10.014

Cited by 6 publications

(6 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Nevertheless, as long as we use data processing by means of electron devices, we have to consider energy losses. Due to the high power dissipations in present-day electronics, cooling and temperature management are and will be an important topic [2][3][4][5][6][7][8][9][10][11][12][13]. Although fan cooling is the most widely used, other alternatives such as natural convection, liquid cooling, heat pipes, new materials, Peltier heat pumps, harvesting, etc.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps

2022

View full text Add to dashboard Cite

A thermal network will be presented to model a multi-layer structure consisting of a semiconductor structure, integrated Peltier heat pump and a cooling fin. A criterion will be set up to determine the optimal Peltier current to minimise the chip temperature using the power dissipation as the control parameter. Compared with classical methods, the proposed solution does not show any time delays in response to power changes and is not sensitive to the position of chip temperature sensors. It does not generate chip temperature oscillations. The idea can be applied in each integrated circuit cooled with Peltier heat pumps, e.g., power devices, high-performance processors, high-frequency integrated circuits, etc. The authors present a simple mathematical formula that can be easily implemented in the software of a processor being cooled. As a consequence, the device is able to operate with maximum efficiency assuming required reliability. Theoretical considerations are illustrated by some results of computations. The paper is addressed to designers involved in the creation of devices dissipating a significant amount of heat energy.

show abstract

Section: Introductionmentioning

confidence: 99%

“…The problem seems to be crucial, especially from two points of view: how to achieve a minimum chip temperature and to obtain maximum device throughput. The throughput improvement in the thermal aspect has been criticised by many authors [3,4,7,9,15,26].…”

Section: Introductionmentioning

confidence: 99%

Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps

2022

View full text Add to dashboard Cite

show abstract

“…It is known as Dynamic Thermal Management (DTM). It is a set of techniques that controls the processor temperature and prevents it from overheating; e.g., reducing of the CPU clocking (DFS-Dynamic Frequency Scaling) or supplying voltage (DVS-Dynamic Voltage Scaling) leads to reduce CPU processing speed and to decrease its temperature [9][10][11][12][13]. DFS and DVS are based on CPU temperature monitoring using an integrated sensor.…”

Section: Introductionmentioning

confidence: 99%

“…In the DTM method the key CPU temperatures are defined [9]: the allowable temperature limit value (T max ), the first limit temperature value (T thr1 ), the second limit temperature value (T thr2 ) and the hypothetical limit temperature value (T coerce ). They meet the dependence T max > T thr1 > T thr2 > T coerce .…”

Section: Introductionmentioning

confidence: 99%

Temperature Difference Sensor to Monitor the Temperature Difference in Processor Active Heat Sink Based on Thermopile

Markowski¹,

Gierczak²,

Dziedzic³

2021

Electronics

View full text Add to dashboard Cite

The monitoring of processor temperature is crucial to increase its efficiency. One of the novel approaches is use the information not only about the CPU (Central Processing Unit) thermal state, but also about changing environmental conditions. The additional temperature difference sensor to monitor thermal changes in the processor environment is necessary. The sensor dedicated for active heat sink, often used inside laptops, was designed, fabricated and investigated. To fulfill the requirements and to match to the specific shape of the active heat sink, the hybrid sensor was proposed. It was composed of six thermocouples and fabricated using thick-film and LTCC (Low Temperature Cofired Ceramic) technology combined with wire thermocouples. Thick-film/LTCC flat substrates with thermoelectric paths ensured good thermal contact between the sensor and the monitored surface. The thermoelectric wires allowed adjusting the sensor to the complicated shape of the active heatsink. Three different versions of the sensor were realized and compared. All of them seem to be suitable for measuring the temperature difference in the given application and they can be used in further works.

show abstract

“…Set of temperature sensors with circuit for maximum temperature detection, which are main subject of this paper, are part of Temperature-Controlled Oscillator (TCO) -a thermally-aware power management system for high performance processors [8,9]. This section will concisely describe proposed TCO structure.…”

Section: Introductionmentioning

confidence: 99%

Maximum Temperature Detection System for Integrated Circuits

Frankiewicz

Kos

2015

Journal of Electrical Engineering

View full text Add to dashboard Cite

The paper describes structure and measurement results of the system detecting present maximum temperature on the surface of an integrated circuit. The system consists of the set of proportional to absolute temperature sensors, temperature processing path and a digital part designed in VHDL. Analogue parts of the circuit where designed with full-custom technique. The system is a part of temperature-controlled oscillator circuit - a power management system based on dynamic frequency scaling method. The oscillator cooperates with microprocessor dedicated for thermal experiments. The whole system is implemented in UMC CMOS 0.18 μm (1.8 V) technology.

show abstract

Optimum control of microprocessor throughput under thermal and energy saving constraints

Cited by 6 publications

References 28 publications

Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps

Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps

Temperature Difference Sensor to Monitor the Temperature Difference in Processor Active Heat Sink Based on Thermopile

Maximum Temperature Detection System for Integrated Circuits

Contact Info

Product

Resources

About