Optical Through-Wafer Interconnects for 3D Hyper-Integration

Thacker, Hiren; Ogunsola, O.O.; Carson, A.; Bakir, Muhannad S.; Meindl, J.D.

doi:10.1109/leos.2006.278802

Cited by 8 publications

(3 citation statements)

References 1 publication

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“…Consequently, power delivery and signaling can be supported by the electrical interconnects (solder bumps and copper TSVs), and heat removal for each stratum can be supported by the fluidic I/Os and microchannel heat sinks. Optical TSVs [41] and I/Os may also be integrated to provide unusual flexibility to system integration. In order to achieve high heat transfer, low thermal resistance, and low pressure drop, a relatively tall microchannel heat sink is needed (≈250 µm, for example).…”

Section: Solder Capmentioning

confidence: 99%

Power delivery, signaling and cooling for 2D and 3D integrated systems

Bakir

Huang

Dang

2010

Integrated Circuits and Systems

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Section: Solder Capmentioning

confidence: 99%

Power delivery, signaling and cooling for 2D and 3D integrated systems

Bakir

Huang

Dang

2010

Integrated Circuits and Systems

Self Cite

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“…In order to support large off-stack bandwidth, optical I/O may be integrated on the bottom-most chip in the stack [ Figure 4]. Optical TSVs [23] may also be integrated to provide unusual flexibility to system integration. In other words, the 3D technology under consideration combines all critical interconnect functions (power, signal and thermal) for a gigascale system [24].…”

Section: Overview Of 3d Integration Technologiesmentioning

confidence: 99%

3D Integrated Circuits: Liquid Cooling and Power Delivery

Bakir

Huang

Sekar³

et al. 2009

IETE Tech Rev

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three-dimensional (3D) integration of ICs provides unique opportunities to improve bandwidth, latency, and power dissipation bottlenecks of interconnects (both on-and off-chip). However, while 3D IC integration improves signal interconnection, it also presents new challenges, especially in power delivery and cooling ("thermal interconnects"). the focus of this paper is on some of the key challenges and promising technologies to address power delivery, cooling, and signaling in a 3D stack of logic ICs.

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“…Particularly, micro-electro-mechanical systems (MEMS) technology can be used to realize these devices [8], [9]. Optical interconnects provide a novel solution for electrical interconnect problems.…”

Section: Introductionmentioning

confidence: 99%

Magnetically-Actuated Swing-Type MEMS Mirror Pair for a Reconfigurable Optical Interconnect

Tsai

Chang

Liu

et al. 2013

J. Lightwave Technol.

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Two different mirror pairs of 45 • -assembled swingtype micro-electro-mechanical systems mirrors for optical interconnects are proposed. Magnetic beads are attached to the back of the mirror plate to enable magnetic actuation. The device is fabricated with the SOIMUMPs process developed by MEMSCAP, Inc. The magnetically-actuated micromirror provides a wide swing angle. The mirror swing angle is also sufficiently wide to enable fine tuning and system reconfiguration. Two designs of torsion springs are employed. The full swing angles are 16.9 • and 9.8 • for the mirrors in the roof-type arrangement pair and parallel-arrangement pair, respectively.

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Optical Through-Wafer Interconnects for 3D Hyper-Integration

Cited by 8 publications

References 1 publication

Power delivery, signaling and cooling for 2D and 3D integrated systems

Power delivery, signaling and cooling for 2D and 3D integrated systems

3D Integrated Circuits: Liquid Cooling and Power Delivery

Magnetically-Actuated Swing-Type MEMS Mirror Pair for a Reconfigurable Optical Interconnect

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