2017
DOI: 10.1109/ted.2017.2726899
|View full text |Cite
|
Sign up to set email alerts
|

On the Physical Behavior of Cryogenic IV and III–V Schottky Barrier MOSFET Devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
9
0

Year Published

2018
2018
2023
2023

Publication Types

Select...
7
1

Relationship

1
7

Authors

Journals

citations
Cited by 29 publications
(9 citation statements)
references
References 33 publications
0
9
0
Order By: Relevance
“…The overall current is modeled by a combination of these processes. Room temperature transport processes at the SB junctions that are used for transistors are most typically fully described by transport over the barrier via thermionic emission (TE), and direct/thermal assisted tunneling through the barrier [9], which are therefore the focus of this section.…”
Section: Current Transportmentioning
confidence: 99%
See 1 more Smart Citation
“…The overall current is modeled by a combination of these processes. Room temperature transport processes at the SB junctions that are used for transistors are most typically fully described by transport over the barrier via thermionic emission (TE), and direct/thermal assisted tunneling through the barrier [9], which are therefore the focus of this section.…”
Section: Current Transportmentioning
confidence: 99%
“…It was often considered as a device that would always perform worse than a conventional MOSFET because of the increased source/drain resistance. While simulations have shown that for very small devices, the SB can be an asset, they have not been commercially viable to date [7][8][9]. Some of the advantages that they still afford, such as economy of fabrication, may prove them yet to be an exploitable technology as the increased environmental and monetary costs of computing become more problematic.…”
Section: Introductionmentioning
confidence: 99%
“…An independent-gate ambipolar SB-FinFET has two conduction modes, depending on the size of SB height dictated by the choice of S/D contact metal. [15] The presence of SB at the contacts ''lifts up'' the potential at the end of the channel that would otherwise slip away from gate control due to the depletion fields of S/D junctions, thus improving device scalability. According to Fig.…”
Section: Device Structures and Modelingmentioning
confidence: 99%
“…Among the innovative devices capable of enabling novel scaling paradigms, reconfigurable field-effect transistors (RFETs) [5] deserve to be mentioned thanks to their inherent polarity control features [6] that can be applied in the fields of energy efficiency devices [7] and multifunctional circuit design. [8] While both pertinence and benefits of this technology were already discussed in several works for either high [9,10] and low [11] temperature applications in the past, newer and more complex concepts of RFET devices, featuring for example multiple independent gates, [12,13] have been developed and must be characterized in terms of their temperature-dependent behavior. Beyond developing a better understanding of the operation of such devices in order to extend to different environmental conditions their applicability in fields where it was already suggested or proven, like hardware security, [14][15][16] it is important to point out how RFETs can successfully overcome many limitations typical for standard devices such as MOSFETs, thanks to their intrinsically distinct working principle.…”
Section: Introductionmentioning
confidence: 99%