2003
DOI: 10.1109/ted.2002.808423
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On the destruction limit of Si power diodes during reverse recovery with dynamic avalanche

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Cited by 73 publications
(30 citation statements)
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“…This system uses characteristics of both forward I-V and reverse C-V with small biasing conditions. However, it has been proved that the said conditions are not enough in physical phenomena like high-level injection [14], dynamic avalanche [19,20] and Kirk effect [21].…”
Section: Extraction Procedure: State-of-art and Algorithmmentioning
confidence: 99%
“…This system uses characteristics of both forward I-V and reverse C-V with small biasing conditions. However, it has been proved that the said conditions are not enough in physical phenomena like high-level injection [14], dynamic avalanche [19,20] and Kirk effect [21].…”
Section: Extraction Procedure: State-of-art and Algorithmmentioning
confidence: 99%
“…In this test, both diodes failed, but apparently for different reasons. The SPT + diode failed due to an over-voltage peak and a subsequent electric field distortion due to the low plasma concentration on the cathode side of the Nbase [11]. In this failure mode, the destruction point is always located in the central part of the active diode area, whereas the SPT diodes always fail at the edge of the main active area junction.…”
Section: Reverse Recovery Ruggednessmentioning
confidence: 99%
“…3, b) на осциллограммах эмиттерного и полного токов, при дальнейшем незначительном повышении выключаемого тока прибор разрушается. Такой колебательный процесс неоднократно наблюдался ранее [3,4] и др. при про-хождении потока свободных носителей из плазмы че-рез ООЗ обратносмещенного pn-перехода как в диодных, так и более сложных структурах, например в IGBT.…”
Section: Introductionunclassified