Abstract:Current printability issues can be attributed to subwavelength lithography and its sensitivity to manufacturing process variations. Resulting process variations cause performance, yield and reliability problems. As noted in ITRS, conventional burn-in test is losing cost-effectiveness in reliability screening. In this paper, we use lithography process corner information in reliability screening. The lithographic process corner information is decoded from circuit measurements using a tester.
We propose two metho… Show more
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