On-Chip Metal Tiling for Improving Grounded mm-Wave Antenna-on-Chip Performance in Standard Low-Cost Packaging

Liu, Qiang; Biggelaar, A.J. van den; Johannsen, Ulf; Beurden, M.C. van; Smolders, A.B.

doi:10.1109/tap.2019.2957713

Cited by 12 publications

(12 citation statements)

References 29 publications

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“…These advantages make it as an extremely attractive choice as a performance enhancement method for MM-Wave AoCs. (d) The use of on-chip metal tiling/dummy metals to act as an AMC: A cost-effective performance enhancement method for the 60 GHz AoC has been proposed in [112]. It is well-known that the dummy metals are required to be added in the design in order to fulfil the metal density design rules of the CMOS or BiCMOS processes.…”

Section: ) Hybrid Methodsmentioning

confidence: 99%

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

2020

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Section: ) Hybrid Methodsmentioning

confidence: 99%

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

2020

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“…The capacitance between the EGS and the patch is defined as C EGS ; the capacitance between the EGS and the ground plane is C EGSG ; the capacitance between the EGS of adjacent unit cells is modelled as C EGSO . All introduced capacitances are in parallel with C o in the equivalent circuit model [38]. The inductor on the EGS, L EGS , appears on the branch of C EGSO .…”

Section: B Embedded Guiding Structures (Egs)mentioning

confidence: 99%

Ultra-Thin Artificial Magnetic Conductor for Gain Enhancement of Antenna-on-Chip

Akhter

Shamim

2022

IEEE Trans. Antennas Propagat.

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System-on-Chip (SoC) has become an attractive solution to achieve highly integrated wireless systems. However, the Antenna-on-Chip (AoC) suffers from poor radiation due to the lossy silicon substrate in standard CMOS processes. Artificial Magnetic Conductors (AMC) with the ground plane above the silicon can enhance the radiation, however, fitting the AMC completely in the thin stack-up (~10-15 μm) is extremely challenging, particularly for frequencies below 100 GHz. In this paper, Metallic Posts (MP) and Embedded Guiding Structures (EGS) have been investigated to reduce the AMC thickness by employing the available vias and metal layers in the stack-up. An in-house CMOS-compatible process has been used to realize the AoC, where typical low-conductivity adhesion layers have been avoided to reduce the undesired losses by using the surface roughness in a unique fashion. With MP and EGS approaches, AMC thickness can be reduced by 33% and 41% respectively. The AMC with EGS fits within an oxide of a thickness of 16 μm. A monopole antenna, backed by this AMC, demonstrates a gain of 5.85 dBi and radiation efficiency of 57% at 94 GHz, bettering the gain and radiation efficiency by 9.15 dB and 42% respectively as compared to the case without AMC.

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“…Therefore, it is difficult to match AoC performance with off-chip antennas since the latter exhibits higher bandwidth, efficiency, and directivity [24], [55]. Other solutions such as micromachining [58], Si lens [24], ground planes [24], dummy metal tiling [59], and artificial magnetic conductors (AMC) [24] are useful to some extent but makes the AoC design complex and costly besides creating new limitations. SiPh with high substrate resistivity allows for improved efficiency and gain for AoC as well as leading to a less complex design.…”

Section: Antenna On-chip Overviewmentioning

confidence: 99%

“…The resulting resonance is not as broad as expected and gain is also nominal. Further optimization in terms of efficiency, gain and distortion is possible with the inclusion of an AMC or ground plane in the design [64], [59]. Table 3.…”

Section: Quasi Yagi Antennamentioning

confidence: 99%

An Analysis of RF On-Chip Antennas in Si-Based Integrated Microwave Photonics

2021

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We investigate the monolithic integration of RF antennas onto a silicon-based integrated microwave photonics (IMWP) chip for short-range millimeter-wave (mmW) communication. The unification of antenna with photonic integrated circuits (PICs) reduces system loss for high data rate communication by eliminating parasitic interconnects. This integration of electronics (antenna) with photonics will be a key milestone leading to increased bandwidth capability and ubiquitous wireless links for emerging applications such as 5G, Internet of Things (IoT), autonomous vehicles, high data rate point-to-point communication, and wireless sensors. Through simulation above 20 GHz, we compare the transmission of three on-chip antenna structures designed in a commercial silicon photonics (SiPh) process and consider them for both inter and intra-chip communication. Results provide insight on the transmission gain variations relative to the antenna orientation from their distinct radiation pattern. The folded monopole structure provides superior gain, smaller footprint with layout flexibility, and good transmission spectra. The analysis supports the idea of a monolithic mmW transmitter integrated with on-chip antennas on IMWP chip.

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On-Chip Metal Tiling for Improving Grounded mm-Wave Antenna-on-Chip Performance in Standard Low-Cost Packaging

Cited by 12 publications

References 29 publications

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

Ultra-Thin Artificial Magnetic Conductor for Gain Enhancement of Antenna-on-Chip

An Analysis of RF On-Chip Antennas in Si-Based Integrated Microwave Photonics

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