“…DWB of III-Vs on Si offers a Si-CMOS-compatible solution for integrated optics with potential for low-cost-high-scalability fabrication. Several optoelectronic devices using wafer bonding have been proposed and demonstrated, from electrically pumped lasers [11], [12], [14], [64]- [70], to modulators [71], [72], amplifiers [73], [74], and PDs with high responsivity or bandwidth [75], [76].…”