2005
DOI: 10.1109/led.2005.856014
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Novel single-poly EEPROM with damascene control-gate structure

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Cited by 9 publications
(4 citation statements)
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“…In recent efforts, a stacked metal-insulator-metal (MIM) and an n-well capacitor have been applied to a single polysilicon EEPROM cell in order to increase memory capacity [1][2][3][4]. The application of the single polysilicon EEPROM is becoming more popular due to its low process cost and satisfactory reliability [5][6][7]. Optimal characteristics of EEPROM include fast program/erase speed, high endurance performance, and low leakage current.…”
Section: Introductionmentioning
confidence: 99%
“…In recent efforts, a stacked metal-insulator-metal (MIM) and an n-well capacitor have been applied to a single polysilicon EEPROM cell in order to increase memory capacity [1][2][3][4]. The application of the single polysilicon EEPROM is becoming more popular due to its low process cost and satisfactory reliability [5][6][7]. Optimal characteristics of EEPROM include fast program/erase speed, high endurance performance, and low leakage current.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, a single-poly electrically erasable programmable read-only memory (EEPROM) is one of the promising solutions for low-cost embedded nonvolatile memory (NVM) applications [1][2][3][4][5][6][7]. A diffused N-well is used as a control gate (CG) in the conventional single-poly EEPROM [1][2][3], which may lead to some problems, such as the large junction capacitance and resistance at the CG, the reduction of the coupling factor (α CG ) and the disturbance to adjacent blocks during CG operation through the substrate [4].…”
Section: Introductionmentioning
confidence: 99%
“…A diffused N-well is used as a control gate (CG) in the conventional single-poly EEPROM [1][2][3], which may lead to some problems, such as the large junction capacitance and resistance at the CG, the reduction of the coupling factor (α CG ) and the disturbance to adjacent blocks during CG operation through the substrate [4]. Recently, metallic CG EEPROM cells with a damascene CG, metalinsulator-metal (MIM) capacitor and polysilicon fingershape (polyfinger) capacitor have been reported as possible solutions to these problems and attracted much attention [4][5][6]. However, these approaches require additional process steps [4,5] or a large cell area and high operation voltage due to small α CG [6].…”
Section: Introductionmentioning
confidence: 99%
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