New photoresist coating method for high topography surfaces

Zandi, Kazem; Ying, Zhao; Schneider, J.-L.; Peter, Yves-Alain

doi:10.1109/memsys.2010.5442482

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…However, the thickness of the dry films is usually over 15 !lm, which decreases the planarity of the wafer surfaces when the films are used as bridge layers. Zandi et al presented a novel technique called Dynamic Surface Tension (DST) coating for coverage of high topography surfaces with photoresist as thin as 1.5 !lm as planar bridge layer [6]. In this paper, a self-assembled and transferred photoresist layer is studied as planar bridge layer suspended over pre etched through holes and deep trenches.…”

Section: Introductionmentioning

confidence: 99%

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Yang

Dou

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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This paper outlines a novel technique for using suspended photoresist above holes and trenches as planar bridge layer in the fabrication of through silicon vias ( T SVs) and beams. Photoresist film is formed through self-assembly on water surface and then transferred to a wafer as planar bridge layer to cover previously fabricated holes and trenches, which can be patterned with photolithography. The suspension capability of the photoresist bridge layer increases with the film thickness. 300 to 500 nm thick photoresist films are able to be suspended on through-vias of up to 60 �m in diameter and 50 �m wide trenches. A novel process flow of TSV has been developed. TSVs of up to 60 �m in diameter have been fabricated, and the upper side of the TSVs is automatically planarized. Cu beams suspended above deep trenches have also been fabricated with the technique. KEYWORDS

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Section: Introductionmentioning

confidence: 99%

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Yang

Dou

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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“…Zandi et al presented 1 Author to whom any correspondence should be addressed. a novel technique called dynamic surface tension (DST) coating for uniform coverage of micromachined surfaces with photoresist as thin as 1.5 μm [8]. In this study, a selfassembled photoresist thin layer was used as a planar bridge layer suspended over deep trenches, and 350 nm thick Cu double-clamped beams and cantilevers were fabricated on the photoresist.…”

Section: Introductionmentioning

confidence: 99%

Self-assembly and transfer of photoresist suspended over trenches for microbeam fabrication in MEMS

Wu¹,

Yang²,

Li³

et al. 2010

J. Micromech. Microeng.

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A novel technique of self-assembly and transfer of a photoresist thin film assisted by metallization is presented for planarization in microelectromechanical systems (MEMS) in this paper. The AZ5214 photoresist thin film was self-assembled on the water-gas interface and then the entire film was transferred to the wafer surface. The photoresist suspended over trenches to form a planar surface proved to be useful as a bridge layer for the subsequent processes in MEMS. Metal layers were then sputtered on the photoresist and patterned by dry etching. After sacrificially etching the photoresist bridge layer, metal beams and cantilevers were released and suspended over the trenches. It was found that the suspension capability of the AZ5214 photoresist thin film increased with the film thickness and a 300 nm thick photoresist was sufficient to span a 50 μm trench without breaking. Both 350 nm thick Cu double-clamped beams and cantilevers, suspended over trenches, were successfully prepared using the proposed method.

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Planarization of high topography surfaces with deep holes and cavities using two-step polymer coating

Huang

Wang

2014

Sensors and Actuators A: Physical

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New photoresist coating method for high topography surfaces

Cited by 4 publications

References 7 publications

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

Self-assembly and transfer of photoresist suspended over trenches for microbeam fabrication in MEMS

Planarization of high topography surfaces with deep holes and cavities using two-step polymer coating

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