2016
DOI: 10.1016/j.solmat.2015.10.002
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N2O plasma treatment for minimization of background plating in silicon solar cells with Ni–Cu front side metallization

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Cited by 8 publications
(2 citation statements)
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“…Pinholes coupled with Light-Induced-Plating (LIP) lead to ghost plating-the deposition/growth of metal in non-contact locations. Ghost plating reduces finger conductivity, causes pattern loss, and shades the cell, all of which are undesirable in our application [15][16][17].…”
Section: Indirect Removal Of Sin Xmentioning
confidence: 99%
“…Pinholes coupled with Light-Induced-Plating (LIP) lead to ghost plating-the deposition/growth of metal in non-contact locations. Ghost plating reduces finger conductivity, causes pattern loss, and shades the cell, all of which are undesirable in our application [15][16][17].…”
Section: Indirect Removal Of Sin Xmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9] In addition, low silver consumption relatively to solar cell efficiency increase makes light-induced electroplating potential in photovoltaic industry. [10][11][12][13][14][15][16][17][18][19][20][21] In this paper, the focus is on the two-layer electrode of light-induced electroplating after screen-printing. [22][23][24][25] The total power losses, consisted by optical losses and electrical losses, are analyzed for different seed layer electrodes widths by screen-printing in the calculation.…”
Section: Introductionmentioning
confidence: 99%