Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications

Bajpai, Vishnu Kant; Pant, Prita; Solanki, Chetan Singh

doi:10.1016/j.solener.2017.06.002

Cited by 11 publications

(10 citation statements)

References 36 publications

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“…The peeling rate was kept constant at 100 mm/min. The average adhesion strength was found to be 2.4 N/mm (Figure f), which indicates better adhesion as compared to the commercial silver metal contact (average peel force strength of 1.5 N/mm) …”

Section: Resultssupporting

confidence: 86%

“…The formation of the phase depends on the amount of Ni and Si available for the reactions, the annealing temperature, and the impurities present in the nickel seed layer. Among the intermetallic Ni–Si compounds, NiSi has a resistivity in the range of 5–18 μΩ cm 2 . Differential scanning calorimetric (DSC) analysis was used to estimate the optimal temperature required for nickel silicide (NiSi) phase formation in the Ni seed layer deposited on the n -type Si wafer.…”

Section: Resultsmentioning

confidence: 87%

“…The average adhesion strength was found to be 2.4 N/mm (Figure 7f), which indicates better adhesion as compared to the commercial silver metal contact (average peel force strength of 1.5 N/mm). 12 3.3. Transmission Line Model (TLM) Analysis.…”

Section: Resultsmentioning

confidence: 99%

“…Technic Inc. USA calculated the cost model for Ni/Cu/Sn solar cells on the basis of market conditions in 2017. The overall savings offered by Ni/Cu-based solar cells is 3.5% USD/W, which was increased to 7.5% USD/W in 2019 as compared to solar cells with Ag metallization . The cost-cutting percentage may rise further in the coming years.…”

Section: Introductionmentioning

confidence: 99%

“…The overall savings offered by Ni/Cu-based solar cells is 3.5% USD/W, which was increased to 7.5% USD/W in 2019 as compared to solar cells with Ag metallization. 12 The cost-cutting percentage may rise further in the coming years. The direct material savings are determined by the trend in the silver market.…”

Section: Introductionmentioning

confidence: 99%

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Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells

Aleem

Vishnuraj

Krishnan

et al. 2021

ACS Appl. Energy Mater.

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An industry-ready strategic process for the fabrication of cost-effective, micropatterned Ni–Cu–Sn front contact metallization has been demonstrated using maskless direct-write lithography, which could effectively reduce the shadow loss and thereby enhance the efficiency of silicon solar cells by increasing the active area. This investigation also addresses the challenging issues in Ni–Cu–Sn metallization, such as adhesion of the seed layer, low-ohmic contact formation, background plating, and cell processing complications. An eco-friendly aluminum paste with a sheet resistivity of 35 mΩ/cm2 has been developed to fabricate the rear contact on silicon solar cells. A front contact metallization grid with an optimal narrow finger width of 20 μm with an interfinger spacing of 1000 μm has been micropatterned using maskless direct-write lithography for the metallization process. To improve the electrical and mechanical properties of the nickel seed layer, the thickness was optimized as ∼100 nm with a contact resistivity of 6.87 μΩ cm2, which exhibited an adhesion strength of 2.5 N/mm. A low ohmic contact intermediate silicide layer has been created at the Ni–Si interface by the rapid thermal annealing process at 420 °C for 90 s with subsequent copper and tin electroplating to form the Ni–Cu–Sn contacts. An average cell efficiency of 18.5% is achieved for silicon solar cells with a micropatterned Ni–Cu–Sn-based narrow line-width front contact grid design, which could exhibit an ∼1% cell efficiency enhancement as compared to commercial Ag screen-printed solar cells. An ∼6% improvement in cell performance is achieved by reducing the shadow loss with the Ni–Cu–Sn-based front contact metallization as compared to the commercial Ag screen-printed metallization.

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Section: Resultssupporting

confidence: 86%

Section: Resultsmentioning

confidence: 87%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells

Aleem

Vishnuraj

Krishnan

et al. 2021

ACS Appl. Energy Mater.

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Recent Advances in Transparent Electrodes and Their Multimodal Sensing Applications

Althumayri,

Das,

Banavath

et al. 2024

Advanced Science

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This review examines the recent advancements in transparent electrodes and their crucial role in multimodal sensing technologies. Transparent electrodes, notable for their optical transparency and electrical conductivity, are revolutionizing sensors by enabling the simultaneous detection of diverse physical, chemical, and biological signals. Materials like graphene, carbon nanotubes, and conductive polymers, which offer a balance between optical transparency, electrical conductivity, and mechanical flexibility, are at the forefront of this development. These electrodes are integral in various applications, from healthcare to solar cell technologies, enhancing sensor performance in complex environments. The paper addresses challenges in applying these electrodes, such as the need for mechanical flexibility, high optoelectronic performance, and biocompatibility. It explores new materials and innovative techniques to overcome these hurdles, aiming to broaden the capabilities of multimodal sensing devices. The review provides a comparative analysis of different transparent electrode materials, discussing their applications and the ongoing development of novel electrode systems for multimodal sensing. This exploration offers insights into future advancements in transparent electrodes, highlighting their transformative potential in bioelectronics and multimodal sensing technologies.

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Narrow Line Width Ni–Cu–Sn Front Contact Metallization Patterns for Low‐Cost High‐Efficiency Crystalline Silicon Solar Cells using Nano‐Imprint Lithography

et al. 2023

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An in‐house‐developed nanoimprint lithography system is designed and developed to demonstrate a commercially viable method for creating Ni–Cu–Sn‐based narrow linewidth finger patterns capable of effectively reducing shadow loss in the front contact metallization on industrial silicon solar cells. Finite element analysis simulation studies estimate that an optimal force of 138 MPa is required to generate damage‐free patterns during nanoimprinting process. The poly (methyl methacrylate) residual layer is removed using reactive ion etching, which enhances the adhesion strength of Ni–Cu–Sn metallization. A low ohmic contact layer at the Si/Ni interface develops after sintering at 420 °C and formation of NiSi layer is confirmed through X‐ray photoelectron spectroscopy analysis as a function of Ar+ ion etching time. An average cell efficiency of 18.10% is achieved for silicon solar cells with micropatterned Ni/Cu/Sn‐based narrow linewidth front contact grid design, which can exhibit ≈1% enhancement in cell efficiency compared to commercial Ag screen‐printed solar cells. The Ni/Cu/Sn‐based front contact metallization can improve the cell performance by ≈6% compared to the commercial Ag screen‐printed metallization by reducing shadow loss and thereby indicating its suitability toward deploying for cost‐effective industrial solar cell manufacturing.

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Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications

Cited by 11 publications

References 36 publications

Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells

Realization of Micropatterned, Narrow Line-Width Ni–Cu–Sn Front Contact Grid Pattern Using Maskless Direct-Write Lithography for Industrial Silicon Solar Cells

Recent Advances in Transparent Electrodes and Their Multimodal Sensing Applications

Narrow Line Width Ni–Cu–Sn Front Contact Metallization Patterns for Low‐Cost High‐Efficiency Crystalline Silicon Solar Cells using Nano‐Imprint Lithography

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